Teams at NXP Semiconductors

Responsible for physical implementation of IP, subsystems, or IC designs from RTL synthesis through GDS. Performs floorplanning, routing, timing convergence, ECOs, and physical verification, including DRC, LVS, electromigration, and IR-drop checks. Contributes to problem-solving and defines physical design strategies for different technology nodes while ensuring technology and reliability requirements are met.

Develop and maintain embedded software and BSP components, perform board bring-up, integrate AI models on embedded hardware, debug system issues, analyze performance, and independently drive technical work from development through validation.

Manage key automotive customer accounts in Greater China, driving demand creation, revenue growth, market share gains, and semiconductor design wins. Build long-term customer relationships, coordinate solution delivery, collaborate across regional and functional teams, and track sales forecasts and reporting. The role requires deep knowledge of China’s automotive OEM and Tier 1 ecosystem, fluency in Mandarin and English, and frequent travel within China.