Jobs at FormFactor, Inc.

Lead development and delivery of advanced cooling solutions for probe card technologies. Define thermal strategy and roadmap, manage and scale engineering teams, drive product development using PLC methodology, coordinate cross-functional prototyping and manufacturing, resolve critical product issues, and deliver program outcomes for schedule, cost, and technical performance.

Lead design and simulation of advanced RF and high-speed digital physical-layer interconnects, develop and correlate EM and circuit models with lab measurements, perform power-integrity simulations, automate simulation workflows, and lead hands-on RF test using VNAs, TDRs, spectrum analyzers and wafer probers. Provide technical leadership, mentor engineers, and collaborate cross-functionally to influence product architecture and manufacturability.

Serve as the onsite Manufacturing IT liaison for the Farmers Branch site, supporting MES, SPC, equipment management, factory automation, and reporting tools. Troubleshoot production-impacting issues, onboard equipment/software, coordinate testing/UAT, drive continuous improvement, and follow IT standards for change management, validation, and security while partnering with operations, engineering, and quality teams.

Perform signal and power integrity analysis, simulation, modeling, and measurement correlation for high-speed interconnects (PCB, package, probe card). Define stack-ups, impedance targets, run EM/circuit simulations, validate models, create SI validation plans, support design teams and customers, and improve modeling workflows to reduce design risk and cycle time.

Lead and maintain controlled documentation and change management for semiconductor manufacturing. Facilitate Change Control Board meetings, manage document lifecycle in document management systems, ensure version control, train stakeholders, support audits, and drive continuous improvement for QMS compliance and operational readiness across sites.

As a Sr Principal Signal Integrity Engineer, you will analyze signal integrity, conduct simulations, validate designs, and support global engineering teams for semiconductor products, improving performance across various projects.

Lead and develop manufacturing technicians in a high-volume semiconductor fab. Execute production schedules, meet KPIs (yield, utilization, on-time delivery), enforce safety and ISO quality standards, drive continuous improvement (Lean/Six Sigma, kaizen), manage hiring/training/scheduling, and coordinate cross-functional resolution of production issues.

Support global treasury functions including bank account and online portal administration, credit and collections analysis, insurance and certificate management, SOX documentation, investment reporting, and cash collection goals. Work closely with Sr. Treasury Manager, shared services, regional controllers, legal, and banks on analytics, reporting, and administrative projects.

Lead R&D and implementation of advanced electroplating and metallurgical processes for MEMS probe fabrication. Define technology roadmaps, design and execute DOE, develop and scale electrodeposition processes, perform materials characterization and failure analysis (SEM, EDS, FIB), drive process control and yield improvements, generate IP, and mentor engineering teams while collaborating cross-functionally to commercialize next-generation probe technologies.

Lead development and implementation of advanced MEMS photolithography processes, drive innovation and IP, perform DOE and statistical process characterization, lead failure analysis using SEM/FIB, collaborate cross-functionally, and mentor engineering teams to enable next-generation probe card technologies and manufacturing-ready solutions.

Lead process development, optimization, and sustaining engineering across probe card manufacturing including semiconductor‑style fab processes, probe stitching, and SMT assembly. Drive yield, equipment qualification, automation, SPC/DOE/FMEA, cross‑functional collaboration with R&D, Quality, and Supply Chain, and build a high‑performing engineering team for a new manufacturing startup in Farmers Branch, TX.

Lead and scale a global Applications Engineering organization in Korea; own customer relationships, drive technical engagements and NPI, align with Sales and Design Engineering, and improve probe design win rates, FA cycle time, and customer satisfaction while developing leadership and operational excellence.

Lead deployment and administration of the electronic Quality Management System (eQMS), digitize quality workflows, and build analytics and BI solutions (Power BI) to monitor quality KPIs. Partner cross-functionally to implement automation, support UAT/validation/training, maintain data integrity and governance, and enable future predictive quality and AI-enabled decision support.

The Director of Global Supplier Quality leads supplier quality governance for semiconductor manufacturing, ensuring compliance, performance management, and driving continuous improvement initiatives across international suppliers.

Define, own, and improve fab metrology, inspection, and yield-monitoring capabilities. Lead AOI tool bring-up, production microscopy, flying probe testing, profilometry, and probe-tip processes. Analyze inspection and SPC data to identify yield limiters, lead root-cause investigations, maintain equipment qualification and documentation, and ensure EHS/cleanroom compliance to drive yield improvement and production stability.

Lead and develop a team of manufacturing technicians in a semiconductor fab to meet throughput, quality, cost, and cycle‑time targets. Manage daily production schedules, KPIs, safety, ISO/EHS compliance, continuous improvement (Lean/Six Sigma), hiring, training, and cross‑functional coordination to resolve production issues and improve yield.

Lead and develop a team of manufacturing technicians in a high‑precision semiconductor fab. Execute production schedules, meet throughput and quality goals, enforce cleanroom and EHS protocols, drive continuous improvement using Lean/Six Sigma, coordinate cross‑functional issue resolution, and manage hiring, training, and performance for assigned shifts.

The Director of Sales leads strategic growth and partnerships with hyperscaler customers in the semiconductor industry, ensuring account performance and cross-functional execution.

Assist in executing and optimizing photolithography and etch processes in a high-volume semiconductor fab. Collect and analyze engineering data, support SPC and FDC systems, maintain process documentation, qualify and maintain tools, collaborate cross-functionally, and work to reduce yield loss while learning from senior engineers.

Lead PCB logical and physical design for high-speed, mixed-signal, RF, and power systems. Perform placement, routing, SI/PI verification, DFM optimization, generate manufacturing packages, develop design methodologies, validate tools, and support design reviews and vendor issue resolution.