Jobs at Ferric, Inc.

Own ATE testing and characterization of mixed-signal power management ICs, including test planning, ATE hardware and program development, KGD and package-level testing, qualification, bench debugging, and production support. Coordinate engineering vendors, drive yield and cost improvements, review customer test data, and assist with failure and root-cause analysis. The role requires mixed-signal IC test expertise, Python programming, lab equipment experience, and strong analytical and communication skills.

Develop, characterize, qualify, and production-release power management ICs. Responsibilities include creating test plans, ATE and bench characterization, production test limit development, wafer and final test disposition, reliability and package qualification, yield enhancement, NPI support, failure analysis, and customer-return investigations. The role also automates characterization and data acquisition using Python and collaborates with design, test, manufacturing, assembly, vendors, fabs, and customers.

Leads product quality and reliability across new product introduction, supplier qualification, manufacturing, and customer deployment. Owns quality for new product programs, conducts supplier audits, monitors technical performance, drives root-cause analysis and 8D corrective actions, and resolves complex customer issues. Uses statistical methods, reliability analysis, QMS practices, and continuous improvement techniques to identify risks and improve product and process quality. Collaborates with engineering, manufacturing, supply chain, and customer teams, with travel to supplier sites in the United States and Asia.

Design and verify analog and mixed-signal CMOS circuits for integrated voltage regulators. Responsibilities include architectural contribution, schematic and post-layout simulation, circuit research, documentation, design reviews, and cross-functional debugging with characterization, test, and applications teams. The role involves full-custom CMOS design, circuit block ownership, chip integration, and supporting verification and production readiness.