D-Fend Solutions Benefits Overview

Lead full lifecycle design and industrialization of high-speed, multi-layer digital PCBs for counter-UAS processing units. Collaborate on architecture, integrate Intel/COMe platforms, execute SI/PI simulations, ensure manufacturability (DFx), and coordinate cross-discipline engineering to resolve thermal, space, and noise constraints.

Lead the end-to-end product lifecycle for a complex, multi-layer counter-drone platform integrating cyber, radar, EO/IR, jammer, hardware, and software technologies. Collaborate with R&D, systems engineering, operations, sales, subcontractors, and technology partners; manage product development and roadmaps; support technical presales, customer presentations, competitive analysis, and go-to-market strategy; and drive product innovation and market differentiation.

Lead and coordinate quality activities across electronic and mechanical manufacturing and subcontractors. Manage supplier qualification, audits, failure investigations, CAPA, and quality KPIs. Support NPI, monitor engineering changes, ensure correct product revisions, improve yields and reduce scrap, and generate quality performance reports while collaborating cross-functionally.