Top Hybrid Hardware Engineer Jobs

Own dense, high-layer-count PCB layout from schematic handoff through fabrication release. Develop stackups, HDI structures, controlled-impedance routing, differential pairs, BGA breakouts, libraries, design rules, and manufacturing documentation. Translate SI/PI constraints into layout rules, conduct DFM/DFA/DFT reviews, manage revisions, and coordinate with fabricators and assembly houses. The role requires expert Cadence Allegro or equivalent Altium experience, production-proven high-speed board design, IPC knowledge, and advanced HDI and fine-pitch package expertise.

Develop and verify high-performance control-path FPGAs for data center networking platforms. Responsibilities include RTL design, testbench development, FPGA synthesis and implementation, timing closure, hardware debugging, system bring-up, board and schematic reviews, and cross-functional integration. The role also automates FPGA workflows using Python, Tcl, or shell scripting and supports production deployment of networking hardware.

Provides technical leadership for complex wireless SoC development from product definition through architecture, design, integration, verification, tapeout, silicon bring-up, validation, and production. Owns chip-level technical decisions, execution planning, risk management, design closure, and cross-functional coordination. Leads resolution of architectural, implementation, and silicon issues while ensuring functional, performance, power, area, cost, and quality objectives are achieved.

Leads the hardware organization responsible for designing, prototyping, testing, manufacturing, and scaling warehouse robots. Owns product lifecycle execution from requirements through volume production, improves reliability and manufacturing yield, establishes engineering standards and processes, directs build-versus-buy and supplier decisions, and builds a high-performing mechanical, electrical, and manufacturing engineering team. Partners with software, autonomy, product, procurement, and customer operations to deliver reliable robots at scale.

Supports and maintains mainframe hardware, including microcode, processor, storage, DASD, and tape configurations. Handles migrations, replication, disaster recovery, incident resolution, vendor escalations, and 24/7 on-call service restoration. Develops automation, tools, documentation, and standardized processes while supporting multiple clients in a leveraged environment. Performs ITIL change management, provides technical consulting, analyzes subsystem performance, and mentors team members.

Own the end-to-end development and production ramp of tactile gloves, from product requirements and industrial/mechanical design through EVT, DVT, PVT, and volume manufacturing. Lead sensing, firmware, calibration, reliability, supplier, contract manufacturer, production test, quality, cost, and schedule efforts. Coordinate prototype iterations and pilot deployments while ensuring the gloves are comfortable, durable, manufacturable, and produce reliable tactile data at scale.

Lead the architecture, mechanical design, configuration, validation, and production deployment of GPU servers and rack-scale AI infrastructure. Partner with NVIDIA, AMD, ODMs, OEMs, data center engineering, networking, and operations teams. Own rack layouts, power distribution, cooling, airflow, cable management, serviceability, qualification, and hardware standards while balancing performance, reliability, manufacturability, scalability, and cost.

Support sustainment and operational maintenance of ground-based radar systems for US Space Force missions. Perform depot-level maintenance, troubleshooting, testing, calibration, repair, systems integration, and lab maintenance. Create engineering drawings, rack assembly documentation, wiring diagrams, and cable assemblies in accordance with ASME and IEEE standards. Document maintenance outcomes and coordinate with engineering teams on lifecycle management, upgrades, and modernization of complex military electronic systems.

Design and develop multilayer PCB layouts for digital, mixed-signal, power, RF, and wireless security products from concept through production. Create schematics, footprints, and libraries; define stack-ups; support signal integrity, impedance control, EMC compliance, manufacturability, and testing. Collaborate with hardware, firmware, RF, mechanical, fabrication, and assembly teams while resolving production issues and improving PCB standards and engineering processes.

Architect and deliver advanced multi-die IC packages for high-performance AI accelerators. Responsibilities include package and substrate design, bump and ball mapping, high-speed signal routing, power distribution, manufacturability, thermal and mechanical optimization, subcontractor management, and collaboration with TSMC or OSAT. The role also supports package bring-up, failure analysis, debugging, qualification, and evaluation of emerging packaging technologies.