About Ethernovia, Inc.
Ethernovia is developing the future of Ethernet-based networks to realize the full potential of software-defined and autonomous vehicles, robotics and other intelligent machines. Founded in 2018, the company’s breakthrough data transport and acceleration technology is ushering in a new era of connectivity and capabilities in the vehicle and at the edge, including highly reliable autonomy, over-the-air servicing and AI-backed applications.
Ethernovia's co-founders are serial technology entrepreneurs with multiple prior successful ventures together. We are well-funded and backed by some of the worlds’ leading technology investors, having secured $154M ($90+M Series-B and $64M Series-A) in total funding to date:
- Ethernovia Raises Over $90 Million Series B to Scale Leading-Edge Autonomy and Physical AI Networking Chips
- Ethernovia Raises $64 Million to Accelerate the Revolution of Vehicle Networks | Business Wire
- (financial backers include: Porsche SE, Qualcomm, AMD, Western Digital, Maverick Silicon, Socratic Partners, Conduit Capital, and CDIB-TEN Capital)
Ethernovia has been recognized in EE Times' prestigious list of the Top 100 Startups for 2025.
- March 2026: Ethernovia Announces HSB-Enabled Networking Board for NVIDIA Holoscan Platforms
- January 2024: Our CEO Ramin Shirani Named MotorTrend Software-Defined Vehicle Innovator Awards Winner (ethernovia.com)
- September 2023: Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm - Ethernovia
- Connected Car News: Helios, Continental, Ethernovia, Avanci, BMW, Mapbox, Porsche, SEMA, Honda, UltraSense, Flex Logix, Diodes Inc., Garmin, Toyota & Caruso | auto connected car news
With talented employees on 4 continents, we have filed 50+ patents to date.
Join Ethernovia’s team to make a lasting impact on the future of packet processor-centric networking solutions to support the real-time sensor, Physical AI, and control data demands of software-defined autonomy across vehicles, robots and intelligent machines. Come share in our success with pre-IPO shares, competitive compensation, and great benefits while growing your knowledge and career with world class talent. We are looking for talented engineers and leaders who have an entrepreneurial spirit and want to drive cutting edge designs from concept to silicon to the future of mobility.
Principal IC Package Design Engineer
Summary:
We are seeking a visionary and deeply technical Principal IC Package Design Engineer to lead the architecture, design, and execution of advanced packaging solutions for our next-generation Ethernet switches and PHYs. You will be responsible for the entire package lifecycle—from early-stage feasibility and architectural definition to detailed layout, signal/power integrity (SI/PI) co-design, thermal management, and mass production release.
This role requires a blend of deep technical expertise in advanced packaging technologies (e.g., Flip-Chip BGA, high-density substrates) and the leadership capability to collaborate across Silicon Design, Systems/PCB, Reliability, and external OSAT vendors.
Key Responsibilities- Package Architecture & Feasibility: Lead the definition of package concepts, substrate stack-ups, bump/ball maps, and pinouts to optimize for system cost, electrical performance, and thermal constraints.
- Detailed Package Design: Execute complex, high-speed, multi-layer package layouts (FCBGA, FCCSP, SiP) utilizing industry-standard EDA tools.
- SI/PI & Thermal Co-Design: Partner closely with Signal/Power Integrity and Thermal engineers to ensure package designs meet stringent targets for high-speed SerDes (56G/112G+), power delivery networks (PDN), and thermal dissipation.
- Substrate Design Integration: Define design rules and manage substrate layout, routing optimization, and manufacturing constraints (DFM/DFA).
- OSAT & Vendor Management: Drive technical engagements with leading substrate suppliers and OSATs. Evaluate vendor capabilities, negotiate design rules, and resolve manufacturing/assembly issues during NPI (New Product Introduction) and production ramp.
- Cross-Functional Collaboration: Act as the bridge between Silicon IC Design and System/PCB teams to ensure seamless chip-package-board co-design and optimization.
- Technology Roadmap: Stay at the forefront of semiconductor packaging trends (e.g., advanced organic substrates, glass substrates, co-packaged optics) to influence Ethernovia’s long-term hardware roadmap.
- Education: B.S. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- 10+ years of direct experience in IC package design and architecture, ideally within high-speed networking, automotive electronics, or high-performance computing (HPC).
- Advanced Packaging: Proven track record of delivering high-volume, complex Flip-Chip BGA (FCBGA), System-in-Package (SiP), and multi-chip module (MCM) designs.
- EDA Tools: Expert proficiency in package design suites such as Cadence Allegro Package Designer (APD), SiP Layout, or Synopsys 3DIC Compiler.
- Signal & Power Integrity Foundations: Strong understanding of electromagnetic theory, transmission lines, crosstalk, and PDN concepts. Familiarity with extraction tools (Ansys HFSS/Q3D, Cadence Clarity) is highly desirable.
- Manufacturing Knowledge: Deep understanding of substrate fabrication processes, assembly line limits, and automotive-grade reliability standards (e.g., AEC-Q100 guidelines).
- Strong problem-solving abilities with a data-driven approach to architectural trade-offs (e.g., performance vs. cost vs. yield).
- Excellent communication skills, with the ability to articulate complex packaging constraints to cross-functional executives and external partners.
What You Can Expect From Ethernovia:
- Technology depth and breadth expansion that can’t be found in a large company
- Opportunity to grow your career as the company grows
- Pre IPO stock options
- Cutting edge technology
- World class team
- Competitive base salary
- Flexible hours
- Medical, dental and vision insurance for employees
Salary Range:
- The actual offered base salary for U.S. locations will vary depending on factors such as work location, individual qualifications, specializations, years of experience, skills, job-related knowledge, and internal equity. The annual salary range for this position is $200,000 - $265,000. The compensation package will also include incentive compensation in the form of pre-IPO ISO options, in addition to base salary and a full range of medical and other benefits.
* Principals Only (No Agencies)
#LI-Hybrid
Skills Required
- Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field
- 10+ years of direct experience in IC package design and architecture
- Experience in high-speed networking, automotive electronics, or high-performance computing
- Proven track record delivering high-volume, complex Flip-Chip BGA, System-in-Package, and multi-chip module designs
- Expert proficiency with Cadence Allegro Package Designer, Cadence SiP Layout, or Synopsys 3DIC Compiler
- Strong understanding of electromagnetic theory, transmission lines, crosstalk, and power delivery networks
- Familiarity with Ansys HFSS, Ansys Q3D, or Cadence Clarity extraction tools
- Deep understanding of substrate fabrication, assembly line limits, and automotive-grade reliability standards including AEC-Q100
- Strong problem-solving abilities and data-driven architectural trade-off analysis
- Excellent communication skills for cross-functional and external partner collaboration
What We Do
At Ethernovia, we’re inventing the future of automobile’s communication . We are transforming automobiles’ communication network to enable the autonomous driving and electrical vehicle (EV) revolutions. Our breakthrough compute, communication, and software ushers in a new era of car connectivity and capabilities. We bring together, accelerate, and unify the car’s sensors, compute, and outside world to enable new advanced driver assistance features and services
