Top Engineering Jobs

Leads the Product Development team in transitioning laboratory prototypes into fielded hardware, firmware, and software products. Responsibilities include managing engineering staff, setting technical direction, overseeing product architecture and system integration, establishing development processes, and owning cost, schedule, and technical performance. The role also supports customer briefings, proposals, invention disclosures, and government and commercial programs, with a focus on RF, millimeter-wave, embedded, and sensor systems.

Develop and lead embedded control systems for RF subsystems used in communications, radar, and electronic warfare applications. Responsibilities include low-level programming, FPGA and microcontroller development, RF system integration and testing, test automation, technical documentation, customer support, proposal contributions, mentoring junior engineers, and collaborating with scientists, engineers, program managers, and customers. The role requires approximately 20% travel and U.S. citizenship.

Leads the Firmware and Software group while contributing hands-on to embedded firmware, FPGA/SoC firmware, control software, test automation, coding, debugging, and system integration. Manages assignments, hiring, mentoring, performance feedback, development standards, CI/CD, testing, schedules, status reporting, proposals, and customer briefings. Requires expertise in C/C++, Python, HDL, FPGAs, DSPs, microcontrollers, and modern software practices, with U.S. citizenship and eligibility for a government security clearance.

Lead the design, development, qualification, and production of infrared detector packaging, cold stages, Integrated Dewar Assemblies, cryogenic hardware, and precision electromechanical systems. Perform thermal, structural, tolerance, and reliability analyses; create CAD models, drawings, specifications, bills of materials, and documentation; apply GD&T; support environmental and qualification testing; participate in customer and design reviews; and provide technical mentorship.

Leads end-to-end development of advanced phased-array radar and AESA systems from R&D through deployment. Provides system architecture, technical leadership, requirements development, trade studies, modeling, simulation, integration, testing, risk mitigation, and customer engagement. Leads multidisciplinary engineering teams, drives technical roadmaps and innovation, supports proposals, publishes technical work, and ensures compliance with military standards and customer requirements.

Designs, implements, tests, and documents high-performance RF, mmWave, and electrical subsystems. Responsibilities include schematic capture, PCB layout, fabrication oversight, module assembly, simulation, testing, thermal and mechanical integration, and adherence to manufacturing standards. The role mentors junior engineers, establishes engineering best practices, collaborates with cross-functional teams, and supports military-application hardware qualification.

Leads end-to-end development of advanced phased-array radar systems, including architecture, requirements, technical reviews, risk mitigation, integration, testing, and deployment. Provides technical leadership across hardware, software, systems integration, and test teams; drives R&D roadmaps and customer solutions. Responsibilities also include invention disclosures, technical publications, customer briefings, and proposal support.

Designs, models, integrates, and tests mechanical and thermal solutions for advanced RF subsystems. Responsibilities include FEA and SPICE simulations, SolidWorks modeling, technical drawings, GD&T, tolerance analysis, hardware integration, software support for monitoring and data acquisition, design reviews, fabrication, and qualification testing for DoD applications.

Develops advanced thermal management technologies for microelectronic, aerospace, and automotive systems. Responsibilities include designing and fabricating thermal components and microsystems, planning heat-transfer experiments and test campaigns, conducting thermal and thermo-structural modeling, collaborating with multidisciplinary teams, communicating research through presentations and publications, documenting inventions, supporting patents, and writing research proposals.

Designs superconducting component layouts for silicon spin quantum computing using Virtuoso and related CAD tools. Develops layout automation for routing, via placement, ground-plane slotting, and metal or dielectric fill. Applies foundry constraints, RF design principles, and manufacturability requirements while collaborating with process, integration, packaging, and design teams. Troubleshoots DRC/LVS issues, supports simulations and reviews, and documents layout methodologies, automation scripts, and design rules.