Top Engineering Jobs

Designs, implements, administers, and supports enterprise storage, SAN, NAS, backup, and disaster recovery environments. Responsibilities include solution engineering, vendor coordination, troubleshooting, upgrades, capacity and performance management, change control, business continuity planning, automation, documentation, training, and 24x7 on-call support. The role requires expertise across NetApp, cloud storage, enterprise storage platforms, Cisco SAN infrastructure, IBM Spectrum Protect, Cohesity, and storage networking protocols.

Designs, develops, tests, and validates AI-enabled solutions, workflow automation, analytics tools, and internal EHSS applications. Translates business processes into scalable technical solutions, builds prototypes and pilots, integrates APIs and enterprise platforms, and supports production deployment. Partners with EHSS, IT, data, AI, PMO, and technology teams to improve operational visibility, risk management, decision-making, governance, security, and long-term solution scalability.

Supports silicon bring-up, testing, and validation of new ASIC devices. Uses laboratory equipment, automation tools, and validation environments to characterize functionality and performance. Develops scripts and AI-assisted workflows, analyzes results, debugs issues, evaluates AI-generated insights, documents findings, and presents recommendations. Collaborates with validation, design verification, and firmware engineering teams while contributing to validation infrastructure and next-generation semiconductor product development.

Optimizes semiconductor fabrication processes, product yield, quality, reliability, cost, and productivity. Leads yield improvement, new product startups, data analysis, DOE, failure analysis, process qualifications, and cross-functional taskforces. Collaborates with wafer fab, process integration, equipment, materials, and test teams to resolve manufacturing issues and establish continuous improvement roadmaps. The role also uses AI-enabled tools responsibly to improve analysis and operational effectiveness.

Lead verification for sophisticated full-chip gate-level memory designs, including LPDDR and DRAM architectures. Simulate, analyze, and debug pre-silicon designs; develop test cases, test benches, and test vectors; run regressions and improve functional coverage. Guide verification methodology, collaborate with global design teams, analyze timing and logic schematics, and use SPICE, Verilog, Python, and AI-assisted automation to improve verification productivity.

Develop, optimize, and sustain semiconductor fabrication processes to improve yield, quality, cost, and productivity. Use SPC/FDC/APC and data analytics to investigate defects, lead process changes, qualify technologies, manage process control plans, and collaborate across manufacturing, quality, and equipment teams.

Supports high-volume semiconductor manufacturing by monitoring and optimizing processes, improving yield and equipment efficiency, resolving process and equipment issues, analyzing manufacturing data, maintaining operational procedures, and implementing continuous improvements. The role requires rotating 12-hour shifts in a cleanroom environment and collaboration with equipment engineers, operations teams, and process owners.

Analyzes semiconductor manufacturing defects and yield data through correlation, spatial signature, defect density, dashboard, and predictive excursion analysis. Develops defect inspection strategies, monitors inline defects, performs pareto and source analysis, and supports yield detractor elimination and killer defect reduction. The role also applies AI and machine learning tools to improve manufacturing quality, process health, and operational effectiveness.

Supports physical implementation of HBM SoC design blocks, including floorplanning, placement, clock tree synthesis, routing, optimization, timing closure, and physical verification. Analyzes timing, power, area, congestion, and signoff results while developing automation scripts and workflows using Python, Tcl, shell scripting, and AI-assisted tools. Collaborates with architecture, RTL, verification, DFT, and signoff teams on next-generation memory designs.

Develop and optimize advanced semiconductor packaging assembly processes, including wafer-level packaging, wafer bonding, and die stacking. Evaluate equipment and materials, establish process parameters, improve yield and quality, reduce costs, and implement process controls. Collaborate across packaging, wafer fabrication, assembly, product engineering, and quality teams to transition technologies from development through high-volume manufacturing. Use statistical analysis, automation, defect analysis, and AI-enabled tools to support process improvement and production readiness.