Top Engineering Jobs

Manufacturing engineering intern supporting semiconductor Diffusion operations. The role analyzes capacity, equipment performance, workstation constraints, downtime, process holds, and product mix impacts. Responsibilities include applying Pareto analysis, SPC, root cause analysis, and capacity modeling; developing data-driven recommendations; collaborating with engineering and manufacturing teams; and presenting findings through technical reports and project reviews.

Analyzes semiconductor defect data and equipment signals to identify root causes, improve yield, and reduce defects across advanced DRAM and HBM processes. The role applies device physics, DOE, SPC, metrology, FMEA, and advanced data analysis. Responsibilities include defining die-loss paretos, monitoring inline yield health, analyzing experiments, identifying process excursions, coordinating corrective actions, and communicating findings using JMP and Python.

Leads DRAM assembly process engineering, including diagnosing process issues, optimizing equipment and materials, improving yield and reducing costs. Validates and deploys qualified process baselines for new products, supports SPC/FDC/RMS/APC systems and site-to-site portability, manages material suppliers, supports audits, and uses AI-enabled tools to accelerate problem solving and data analysis.

Leads advanced analog and custom digital IC layout design for High Bandwidth Memory products. Responsibilities include critical block and full-chip integration, reticle and TSV design, advanced packaging collaboration, layout verification, tapeout support, DFMEA maintenance, project planning, quality management, and mentoring junior engineers. Requires extensive experience with Cadence and Calibre tools, advanced CMOS technologies, physical verification, critical analog blocks, and multiple concurrent layout projects.

Lead semiconductor dry etch process engineering activities, including diagnosing assembly process issues, optimizing processes, equipment, and materials, improving yield and reducing costs. Qualify and deploy process baselines, tools, and materials for new products; support SPC, FDC, RMS, and APC systems; enable site-to-site portability; manage material suppliers; support audits; and apply AI-assisted problem-solving tools.

Analyzes inline, parametric, probe, and experimental wafer data to identify yield limiters and semiconductor process issues. The engineer uses device physics, electronics, manufacturing-process knowledge, and statistical analysis to resolve yield problems, communicate process and tool issues, support corrective actions, publish yield Pareto analyses, and collaborate across teams. Responsibilities also include technology transfers from R&D to production fabs and responsible integration of AI-enabled tools.

Investigate semiconductor yield and technology issues through electrical and physical failure analysis. Use EMMI, OBIRCH, thermal analysis, SEM, FIB, TEM, nanoprobing, and related methods to isolate failures, determine root causes, and improve memory product yield. Collaborate with engineering and R&D teams on process and design improvements, technology introduction, product qualification, yield ramp, and high-volume manufacturing. Develop analytical methodologies and support continuous improvement initiatives.

Manufacturing Equipment Engineering Intern supporting semiconductor manufacturing teams with process improvement, equipment optimization, yield and quality analysis, root cause investigations, and continuous improvement. The role involves analyzing production data, developing data-driven engineering recommendations, collaborating cross-functionally, and using AI, automation, advanced analytics, and digital manufacturing tools. Interns will produce technical documentation, project findings, improvement recommendations, and stakeholder presentations.

Leads DRAM process engineering initiatives, diagnosing process issues, optimizing materials and process steps, improving yield, reducing costs, and qualifying new technologies, tools, and materials. Supports technology development projects across sites, conducts process characterization and margin studies, applies DOE, documents results, develops technical solutions, and establishes yield roadmaps. Uses AI-enabled tools for problem solving and data analysis while mentoring engineers and contributing to patentable innovations.

Entry-level Process Integration Engineer responsible for optimizing semiconductor manufacturing processes, improving yield, cost, quality, and reliability, and supporting technology transfers for next-generation memory devices. Responsibilities include root cause analysis, DOE, trend monitoring, FMEA, 8D, SPC/FDC, process and material qualification, supplier audits, and cross-functional collaboration. The role requires international travel for technology transfer or training and may involve shifted schedules.