Top Engineering Jobs

Design, develop, and characterize semiconductor fab equipment; supervise installation, upgrades, and decommissioning; collaborate with vendors; maintain technical and maintenance documentation; support audits and corrective actions; and use analytics and generative AI tools for documentation, project execution, and data-driven decisions.

Lead advanced semiconductor packaging technology development, including HBM, 2.5D integration, 3D stacking, and hybrid bonding. Define technology roadmaps, integrate processes with internal and external partners, lead multidisciplinary teams, evaluate competitive trends, and guide strategic technical decisions. Apply AI-enabled tools and data analytics to improve engineering efficiency and innovation. Mentor engineers, troubleshoot complex issues, support cost and quality improvements, and contribute patents, technical papers, presentations, and successful technology builds.

Develops HBM FILM processes and improves yield for advanced packaging, including chip stacking and 2.5D/3D technologies. Troubleshoots complex process issues, performs root-cause analysis, and supports on-site execution as a technical consultant. Coordinates mechanical characterization across global sites, recommends test structures and vehicles, evaluates materials, presents data, and collaborates with packaging material suppliers to support technology roadmaps.

Develop next-generation SSD hardware architectures from concept through production. Define architectures, design power topologies, ensure power integrity, simulate and analyze designs, and improve performance and reliability. Collaborate with firmware, system, and validation teams, participate in design reviews, develop requirements, and mentor hardware engineers. The role requires expertise in circuit design, PCB implementation, high-speed routing, signal and power integrity, and simulation tools.

Develop and maintain UVM-based SystemVerilog verification environments and Python testbenches for advanced ASIC and SoC designs. Define and execute block- and system-level verification plans, debug functional and integration issues, drive coverage closure, and improve verification quality. Collaborate with design and post-silicon validation teams while evaluating AI-assisted techniques to increase verification productivity and debugging efficiency.

Define and standardize global Defense Line 4 process-control workflows across semiconductor sites. Drive automation and AI enhancements, monitor assembly and test specifications, improve test coverage, analyze electrical test data, model failure modes, perform root-cause analysis, and coordinate cross-functional projects involving product engineering, quality, packaging, and test systems teams.

Supports NAND product development from silicon through system integration. Responsibilities include translating business and SSD requirements into qualification specifications, developing AI-enabled data workflows, coordinating technology, design, fabrication, assembly, test, quality, supply chain, and business teams, and managing product qualification priorities. The role leads reviews, cross-functional meetings, capability assessments, and resolution of NAND-system issues to enable timely customer product qualification.

Leads system-level validation, integration, and joint qualification of enterprise and datacenter NVMe SSDs. Responsibilities include developing validation strategies and test plans, performing system bring-up and debugging across hardware, firmware, drivers, operating systems, and platforms, conducting failure analysis, supporting customer issue reproduction, and improving automated Python-based testing and AI-enabled validation workflows. The role also mentors engineers and coordinates qualification activities across firmware, hardware, manufacturing, product engineering, and customer engineering teams.

Supports semiconductor ASIC test laboratory operations, including Teradyne UltraFLEX testers, wafer probers, handlers, burn-in systems, and test hardware. Performs equipment setup, qualification, calibration, preventive maintenance, troubleshooting, repairs, and uptime improvements. Supports ASIC bring-up, characterization, NPI, HTOL and ELFR qualification, failure analysis, and test hardware correlation. Maintains procedures, manages spares, coordinates vendors, and applies scripting, automation, and AI-assisted workflows to improve laboratory efficiency.

Leads NAND product engineering and development, translating business and SSD requirements into qualification specifications. Builds AI-enabled workflows for data extraction, analysis, and program management. Coordinates NAND integration with technology, design, fabrication, assembly, testing, quality, supply chain, and business teams. Represents engineering in reviews, leads cross-functional meetings, organizes capability reviews, and resolves complex NAND-system issues to support timely product qualification and customer delivery.