Top Engineering Jobs

As a Fab Engineer, you will start up, develop, and optimize processes to improve product quality, resolve manufacturing problems, and manage supplier relations to achieve quality and cost objectives.

The role focuses on process development and optimization for Plasma-CVD and Diffusion processes in NAND Flash products. Responsibilities include designing experiments, characterizing processes, collaborating with multi-functional teams, and troubleshooting issues in manufacturing.

The PI Engineer drives process integration for HBM products during NPI, collaborating cross-functionally to ensure readiness and resolve issues while leveraging AI tools for efficiency.

Responsible for verification of DRAM critical timings, guiding verification efforts, analyzing full chip designs, and developing verification methodologies.

The role focuses on product reliability, involving test development, execution, problem-solving, risk management, and cross-functional collaboration to drive innovations in high bandwidth memory technology.

The Engineering Execution Manager will lead HBM product development through all phases, manage schedules, coordinate cross-functional teams, and communicate status and project priorities.

This role involves optimizing semiconductor processes and equipment, improving production efficiency, resolving process issues, and integrating AI tools for better outcomes.

The role involves developing advanced verification components for SOC designs, executing verification plans, debugging issues, and collaborating with design teams.

Provide strategic and technical leadership for construction engineering governance and Asia regional support for large-scale semiconductor fab programs. Define standards, playbooks, and execution methodologies; lead constructability reviews, commissioning readiness, and multi-discipline teams; support design integration, cost/schedule input, risk mitigation, and global stakeholder alignment to ensure safe, consistent, and high-quality facility delivery.

Lead process integration efforts for next-generation 3D NAND: identify yield gaps, develop process solutions, coordinate R&D-to-manufacturing transfers, run experiments, support ramp and qualification, and apply AI to optimize workflows and decisions.