Top Engineering Jobs

Lead thin films process development for advanced DRAM: diagnose and resolve process issues, drive yield/cost/productivity improvements, validate and scale new processes/tools/materials, manage supplier quality and audits, and support product ramps.

Develop and optimize dry etch processes for next-generation DRAM, collaborate with integration and process teams, perform root cause and defect analysis, apply statistical methods to improve process capability and manufacturing readiness, and support process transfer and production issue resolution.

Lead development, optimization, and transfer of advanced DRAM wet processes (cleans, etch, plating). Drive technology roadmaps, troubleshoot via root-cause analysis, collaborate cross-functionally and with vendors, and influence strategic process and tooling decisions to enable high-volume manufacturing.

Plan and optimize semiconductor fab equipment layouts using industrial engineering principles. Maintain and validate layout documentation, perform onsite feasibility assessments with Facilities and tool owners, collaborate with Manufacturing and Engineering, support cleanroom operational readiness, and integrate AI-assisted tools to improve layout planning and continuous improvement.

Support photolithography process development for advanced memory tech through hands-on experiments, DOE/SPC data analysis, troubleshooting, defect and overlay analysis, integration learning, and cross-functional collaboration to improve yield and enable manufacturing ramps.

Manage the lifecycle of High Bandwidth Memory (HBM) products, driving development across teams, schedule management, and communication of progress and priorities.

Lead global Dry Etch tool installation qualification (TIQ) efforts: define and improve TIQ processes, drive cost and schedule targets, manage programs, align sites and suppliers, develop TIQ documentation, enable first-of-a-kind tool introductions, and apply AI/digital tools to improve operational efficiency and insights.

The role involves developing layouts for DRAM chips, performing layout verifications, guiding team members, and collaborating with global engineering teams to deliver high-quality projects on time.

The Process Integration Engineer will lead technology development, design experiments, evaluate device performance, and manage projects in advanced memory production for Micron's semiconductor division.

Perform thermo-mechanical and multiphysics simulation for advanced semiconductor packaging (HBM, 2.5D/3D). Develop material models, analyze fatigue/fracture/reliability, model interfaces and failure mechanisms, validate with characterization, and integrate AI/ML and automation to accelerate simulation workflows and improve predictive fidelity while collaborating across package architecture and manufacturing teams.