Top Engineering Jobs

Lead verification for complex full-chip HBM and emerging memory designs. Responsibilities include defining verification direction, simulating and debugging pre-silicon designs, developing test cases and stimulus, building verification environments and test benches, running regressions, analyzing functional coverage, and improving verification flows. The role also involves collaboration with global design teams and applying AI to automate technical and non-technical processes.

Establishes and improves semiconductor process conditions, capability, and cost efficiency. The role sets process parameters for semiconductor equipment, manages process improvement projects, evaluates new equipment and materials, and analyzes and resolves production abnormalities. It also supports technology upgrades, equipment planning, and the use of artificial intelligence.

Lead and build PVD/CVD process engineering teams for high-volume manufacturing: hire and develop engineers, drive yield improvement via data-driven problem solving, implement AI/advanced analytics and automation, manage process qualification and ramp, and promote safety and operational alignment with factory goals.

Establishes and improves semiconductor process conditions, capability, and parameters; reduces production costs; manages process projects; evaluates new equipment and materials; and analyzes and improves abnormal production conditions.

Leads verification architecture and methodology for next-generation HBM designs. Responsibilities include developing verification plans, coverage strategies, sign-off criteria, UVM-based testbenches, reusable components, and formal verification approaches. The role partners with build teams, drives verification completeness, manages simulation and regressions, mentors engineers, and influences technical direction. AI-enabled verification and automation using Python or TCL are also encouraged.

Lead verification efforts for complex full-chip gate-level memory designs. Simulate, analyze, and debug pre-silicon DRAM and emerging-memory designs; develop test cases, stimulus, test benches, and test vectors; run regressions and improve functional coverage. Guide verification strategy, develop AI-enabled verification methodologies and environments, and collaborate with globally distributed design and verification teams on new memory verification flows.

Processes reticle design data through Optical Proximity Correction for semiconductor photolithography. Monitors production compute farms, licensing, alerts, job flows, and tapeout status; troubleshoots basic issues; analyzes production metrics; documents problems; and coordinates across global teams to maintain efficient, accurate production operations.

Supports DRAM and memory product development by designing, laying out, modeling, simulating, and validating digital, analog, and logic circuits. Responsibilities include floor planning, placement, routing, parasitic modeling, reticle experiments, tape-out revisions, and manufacturability coordination. The intern collaborates with verification, CAD, process integration, test, assembly, product engineering, and marketing teams, while exploring AI and scripting to automate processes and organize data.

The Technician performs repairs and adjustments on electro-mechanical equipment, dismantles and assembles machinery, and uses test equipment for diagnostics and troubleshooting.

Lead end-to-end physical design for HBM base and memory dies, including floorplanning, placement, CTS, routing, power integrity, timing and signoff. Drive HBM-specific architecture, PDN/thermal/IR/EM closure, packaging integration, ECO strategies, automation, and mentor engineers to improve flows across HBM generations.