Top Engineering Jobs

Develop SEM, ADC, Brightfield, and Darkfield inspection recipes and statistical process control methods for semiconductor wafer fabrication. Troubleshoot process anomalies, monitor fab line health, analyze inspection data, support experiments, and improve defect detection strategies. Collaborate with process integration, development, data science, yield analysis, and global technical teams in a high-volume manufacturing environment.

Supports legacy DRAM products through electrical and physical failure analysis, yield improvement, reliability enhancement, and root-cause investigations. Uses statistical analysis, data visualization, and AI-supported workflows to identify fabrication, assembly, and testing issues. Collaborates with Product, Process, Quality, and Test Engineering teams to resolve defects and improve component performance. Communicates technical findings through reports and presentations.

Leads development and integration of advanced thermal, vapor, and atomic layer etch processes for next-generation DRAM. Owns process roadmaps, feasibility studies, technical investigations, root-cause analysis, yield improvements, and technical readiness. Collaborates with process integration, equipment engineering, hardware vendors, and cross-functional teams while contributing to intellectual property and evaluating emerging technologies.

Execute system settings according to standard operating procedures, collaborate with senior engineers to resolve technical issues, develop solutions using Micron tools to improve labor efficiency and reduce conversion risks, and support continuous improvement of engineering processes in a semiconductor manufacturing environment.

Develops EDA/CAD software, automation, and AI-assisted tools for custom memory IC design workflows, including layout, verification, simulation, and tape-out. Collaborates with global design and CAD teams to identify automation opportunities, integrates and qualifies EDA tools, and applies generative AI, machine learning, and LLM technologies to improve productivity, quality, and cycle time. Maintains scalable, tested, documented technical software and workflow integrations.

Leads semiconductor fab layout and process tool planning for new construction, expansions, and remodels. Develops cleanroom layouts, tool siting plans, aisle strategies, and support spaces to optimize capacity, accessibility, utilization, and scalability. Partners with engineering, facilities, utilities, construction, and AMHS teams to integrate equipment and infrastructure. Coordinates design reviews, supports fab readiness and issue resolution, ensures standards compliance, and uses analytics, automation, visualization, and AI-enabled tools to improve planning and decision-making.

Coordinates process improvements for NAND Flash manufacturing, focusing on yield, quality, reliability, and output. Designs and analyzes experiments, investigates process and quality issues, interprets complex data, and collaborates with process, equipment, production, industrial engineering, and global teams. Leads cross-functional efforts, supports process alignment across fabs, and uses AI-assisted tools to improve operational efficiency and decision-making.

Supports HBM architecture research, performance modeling, simulation framework development, and AI cluster trend analysis. Responsibilities include researching compute and infrastructure trends, analyzing bandwidth and latency requirements, developing modeling tools, building benchmark dashboards, and collaborating with senior engineers on next-generation AI memory architectures.

Supports semiconductor process engineering, Real-Time Defect Analysis, and metrology activities in a memory manufacturing fab. Responsibilities include data collection and analysis, SEM and defect review support, measurement and equipment workflows, documentation, request tracking, and process improvement. The intern will collaborate with engineers and technicians and complete an AI-focused project involving RDA, metrology, automation, data analysis, or recipe workflows before presenting findings.

Analyze inline, parametric, probe, and experimental data to identify wafer-yield limiters and resolve process or tool issues. The engineer applies semiconductor device physics, electronics, manufacturing-process knowledge, and statistical analysis to improve yield, quality, and technology ramp. Responsibilities include communicating yield findings, creating Pareto analyses, collaborating across Fab and Yield Enhancement groups, supporting cross-functional problem-solving teams, transferring new technologies into production, and responsibly integrating AI-assisted tools.