The Wafer Packaging Manufacturing (WPM) SORT Test Engineering Organization in Leixlip is looking for motivated Module Process Engineer to support its operations.
The engineers in this team work with worldwide and local Intel teams to sustain and improve product, process and equipment health in the automated wafer test process and to enhance the quality, reliability and manufacturing of the overall test operation.
The successful candidates will have the opportunity to influence and optimize the test and processing environment for some of the most advanced CPU and System-On-A-Chip (SOC) products in the market. They will gain an understanding of Intel's chip architectures, test methods and processing flow in an environment that fosters and rewards technical innovation.
Responsibilities include but are not limited to
Continuous technical learning about the Intel's Test Platforms - incl. Semiconductor logic tester, 300mm wafer handler, probe card interface, test program and SW applications / embedded controllers, Integration flows and Sort systems.
Working with cross functional teams on investigation and debug of test platform failures - Electrical, Process, Mechanical, Optical, S/W.
Containment and disposition of production material impacted by such failures (production material = ICs under test).
Data mining (writing scripts to extract data) and data analysis of test results and tool logs to early-detect performance issues with the Test Platforms.
Statistical analysis of IC parametric test-results across the fleet of test equipment to detect discrepant equipment.
Investigation of parametric signals and correlate to test circuitry or mechanical/optical system - to isolate failing H/W.
Provide a point of escalation for technicians experiencing problems in their process/equipment debug activities.
Coach technicians on debug activities - document investigations and creation of debug content (instruction manuals and videos) for the technicians to improve performance of repair team.
Project managing new-product readiness - new test-methods - equipment upgrades/conversions and debug of test marginalities on new products.
Work with other engineering groups to improve overall performance of testing.
Managing the spares portfolio for the equipment and coordinating spares repair loops.
Manage Equipment performance, availability and can troubleshoot failures in a timely manner to ensure availability goals are met.
Develop scripts and processes to optimize test activities - often in collaboration of other international Intel sites.
Collaborate with Intel sites internationally on the continuous improvement of the Test Environments to stay ahead of latest technology demands (releasing, testing, contributing content to new products and test capabilities) - Scripts, procedures, debug methods.
Continuous learning about Intel products, IC test methodologies, new languages, and debug methods - applying this knowledge in the debug of evolving product signals.
Understanding and improvement of Sort Integration and Shipping systems.
Understanding of Sort Systems and Supply Chain operations.
A minimal qualification of honors degree (NFQ Level 8) in Electronics, Mechatronics, Electrical, Computer Engineering, Applied Physic\Skills or a related STEM field.
Minimum of 2 years experience
Must be a fast learner capable of researching new topics.
Must have the ability to solve problems independently.
Must also be a good communicator and capable of working as part of a team as often the problems involve several groups (S/W, H/W and process).
The ability to project plan and prioritize your work is essential.
Some aptitude for scripting/programming - with some practical experience of any language - Python/C#/SQL... or similar.
Data analysis to solve problems (Pivots, SQL, Power Bi and JMP.) would be an advantage.
Practical experience of debug and problem solving under time constraints.
Moderate knowledge of statistics.
An understanding of micro-electronics / Semiconductor physics is helpful.
Understanding of AI and willingness to implement AI into Sort processes is an advantage.
Job Type:Experienced HireShift:Shift 1 (Ireland)Primary Location: Ireland, LeixlipAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A
EU Salary
We offer a total compensation package that ranks among the best in the industry.
Annual Salary Range for this job which could be performed in Ireland is: €49,300.00 - €92,600.00 The compensation range displayed in this posting reflects the minimum and maximum target compensation for this position. Within this range, individual pay is determined by job related skills, experience, and relevant education, training. As part of our total compensation approach, the final offer may include additional pay components and benefits. Your recruiting team will share the confirmed base salary along with any applicable total compensation elements upon employment offer delivery.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
Skills Required
- Honours degree (NFQ Level 8) in Electronics, Mechatronics, Electrical, Computer Engineering, Applied Physics or related STEM field.
- Minimum of 2 years experience.
- Fast learner capable of researching new topics.
- Ability to solve problems independently.
- Good communicator and capable of working as part of a team.
- Project planning and prioritization skills.
- Practical experience in scripting/programming (Python, C#, SQL or similar).
- Data analysis skills (Pivots, SQL, Power BI, JMP).
- Practical experience of debug and problem solving under time constraints.
- Moderate knowledge of statistics.
- Understanding of micro-electronics / semiconductor physics.
- Understanding of AI and willingness to implement AI into Sort processes.
- Ability to work on-site in Leixlip and on assigned shift.
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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