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TI is seeking an innovative and highly skilled GaN Process Integration Engineer to join our cutting-edge Gallium Nitride (GaN) Technology Development Team. This role offers the unique opportunity to work at the forefront of developing Gallium Nitride technology that is redefining the power electronics landscape — enabling higher efficiency, faster switching, and smaller, more reliable systems. You will be instrumental in developing and scaling GaN power process technologies for high-volume manufacturing. You’ll collaborate across disciplines to deliver state-of-the-art devices with world-class performance and reliability.
About the job
This position is focused on leading the development, characterization and optimization of gallium nitride (GaN) power devices. As part of TI's Advanced Technology Development (ATD) team, the role involves close collaboration with fab/manufacturing, business units and Kilby Labs. This position requires in-depth knowledge of III-nitride materials, device physics, and reliability. The scope of the job includes, but not limited to:
- GaN device simulations (TCAD), device design, layout
- Develop robust process flows, drive design-of-experiment (DOE) execution, and solve complex integration challenges
- Collaboration with fab/manufacturing engineers to ensure device manufacturability
- Collaboration with reliability engineers to meet device reliability requirements
- Failure root-cause investigation for device/process/reliability/yield improvement
The ideal candidate is expected to have a strong understanding of the following:
- Power FETs and other relevant semiconductor device physics
- Typical analog silicon and GaN high electron mobility transistor (HEMT) process flows and the underlying process physics
- Electrical and materials characterization methodologies and statistical data analysis
- Strong hands-on lab experience and excellent problem solving skills are also needed
- Excellent verbal and written communication skills are a must as the position requires interfacing with multiple teams
Minimum requirements:
- PhD in Electrical Engineering, Electrical & Computer Engineering, Materials Engineering, Physics, or related degree
- Research experience in GaN or compound semiconductor device/process development
- Minimum cumulative GPA of 3.0/4.0
Preferred qualifications:
- Familiarity with GaN-on-Si technology for power switching applications
- Experience with fab tools and process modules/Integration
- Strong communication and data analysis skills
- Knowledge of device physics, reliability mechanisms, and packaging interaction
- Ability to work in teams and collaborate effectively with people in different functions
- Ability to take the initiative and drive for results
- Sound decision-making capabilities and the ability to prioritize tasks and adapt accordingly
- The future starts here. As a TIer, you'll play a critical role in defining the next era of semiconductor technology and help create the innovations that shape the world around us.
- Surround yourself with a team of innovators who value your unique perspective and will challenge you to bring your best self to work every day. We believe that fostering a culture of collaboration fuels both personal growth and technological breakthroughs. Explore our company culture.
- At TI, your success goes beyond your work. Take advantage of comprehensive benefits designed to support your total well-being at work and in life, from competitive compensation to extensive health coverage and wellness programs. Learn more about our benefits offerings.
Skills Required
- PhD in Electrical Engineering, Electrical and Computer Engineering, Materials Engineering, Physics, or a related field
- Research experience in GaN or compound semiconductor device and process development
- Minimum cumulative GPA of 3.0 on a 4.0 scale
- Familiarity with GaN-on-Si technology for power switching applications
- Experience with fabrication tools and semiconductor process modules or integration
- Strong communication and data analysis skills
- Knowledge of device physics, reliability mechanisms, and packaging interaction
- Ability to collaborate effectively across functions
- Ability to take initiative and drive results
- Sound decision-making, prioritization, and adaptability
Texas Instruments Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Texas Instruments and has not been reviewed or approved by Texas Instruments.
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Strong & Reliable Incentives — Profit sharing and annual bonuses are portrayed as a meaningful, formula-linked upside that can materially lift total earnings in strong years. An employee stock purchase plan with a discount further reinforces recurring, wealth-building incentives.
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Retirement Support — A 401(k) match is described as a stable core benefit, with some references to additional legacy employer contributions and even pension-like elements for certain cohorts. This framing positions long-term savings support as a notable part of the overall rewards package.
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Healthcare Strength — Medical coverage is depicted as broadly comprehensive, with preventive care and access to HSA/FSA features cited as value-adds. Company-seeded HSA contributions are repeatedly characterized as an important offset to the plan design for those enrolled.
Texas Instruments Insights
What We Do
Texas Instruments develops semiconductor and computer technology for cellular handsets, digital signal processors and analog semiconductors. Texas Instruments has been making progress possible for decades. We are a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. Our more than 80,000 products help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. Our passion to create a better world by making electronics more affordable through semiconductors is alive today as each generation of innovation builds upon the last to make our technology smaller, more efficient, more reliable and more affordable – opening new markets and making it possible for semiconductors to go into electronics everywhere. We think of this as Engineering Progress. It’s what we do and have been doing for decades. Learn more https://news.ti.com/index.cfm
