Key Responsibilities:
1.Perform wire bond process task on quality hold material
2.Collaborate with engineering to improve WB processes and techniques.
3.Assist in resolving WB-related issues to minimize production downtime.
Requirements:
1.Diploma or above in Engineering or a related field.
2.Working experience with WB process is preferable and recommended
3.Strong attention to detail and technical troubleshooting skills.
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Skills Required
- Diploma or higher in engineering or a related field
- Working experience with wire bonding processes
- Strong attention to detail
- Technical troubleshooting skills
What We Do
NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer and more sustainable world through innovation. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 34,500 employees in more than 30 countries and posted revenue of $13.21 billion in 2022. Find out more at www.nxp.com. Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA
