Intel Corporation is one of the world's leading semiconductor companies, dedicated to designing and manufacturing innovative technology that powers the devices and infrastructure shaping modern life. With a legacy of breakthrough innovation spanning decades, Intel continues to push the boundaries of what's possible — from advanced chip manufacturing to next-generation packaging technologies. At Intel, we believe in the power of human ingenuity, and we're committed to creating an inclusive, collaborative environment where the brightest minds come together to change the world.
We are looking for a talented and driven Module Development Engineer to join Intel's Wafer Assembly Technology Development (WATD) group in Oregon. In this high-impact role, you will be at the forefront of advancing Intel's semiconductor manufacturing capabilities, driving the design, development, and optimization of complex processes and equipment. Your work will directly influence Intel's technology roadmap, manufacturing efficiency, and product quality — helping Intel maintain its leadership position in global semiconductor innovation. This is a unique opportunity to work alongside industry experts, collaborate with world-class suppliers, and contribute to technologies that will define the future of computing.
Key Responsibilities:
- Lead the design and development of advanced manufacturing processes and equipment solutions for next-generation semiconductor products
- Conduct feasibility studies using theoretical simulations and practical engineering methods to meet device specifications
- Optimize process integration through material selection, equipment metrology, and parameter settings for new product designs
- Perform pathfinding activities to develop processes and hardware for innovative device architectures
- Develop and implement technology roadmaps that support future manufacturing needs
- Recommend and implement modifications to equipment and manufacturing techniques to improve efficiency, reliability, and output
- Collaborate with equipment suppliers and materials vendors to develop enabling technologies for advanced manufacturing solutions
- Design and execute experiments using statistical methodologies (DOE, SPC) to optimize process windows and control strategies
- Stay current with industry trends, emerging technologies, and process innovations, contributing to Intel's competitive edge
As a Successful Candidate, You Will Bring:
- Communicates complex technical concepts clearly and confidently to diverse audiences
- Thrives in a collaborative, cross-functional team environment
- Approaches challenges with curiosity, creativity, and a solutions-oriented mindset
- Demonstrates strong attention to detail and a commitment to quality
- Adapts quickly to evolving priorities and ambiguous problem spaces
- Takes ownership of your work and drives initiatives through to completion
- Builds strong relationships with internal teams, vendors, and industry partners
- Leads with integrity, humility, and a passion for continuous learning
If you're passionate about pushing the boundaries of semiconductor technology and want to be part of a team that's shaping the future of computing, we want to hear from you. Apply today and take the next step in your career at Intel — where your ideas, expertise, and ambition can truly change the world.
Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This Position is not eligible for Intel immigration sponsorship.
Minimum Qualifications:
- Bachelor’s degree in mechanical engineering, chemical engineering, materials science, electrical engineering, physics, or a related STEM field with 9+ years of relevant experience; OR Master's degree in a related STEM field with 6+ years of relevant experience; OR PhD in a related STEM field and 4+ years of relevant experience
- Relevant experience can be any of the following:
- Semiconductor processing, wafer-level assembly, or cleanroom environments
- Process development methodologies, statistical process control, and manufacturing process improvement
- Hands-on experience with module engineering, equipment troubleshooting, and preventive maintenance procedures
Preferred Qualifications:
- 10+ years of experience in:
- Leading process development programs from strategy formation to high-volume production
- Direct experience with semiconductor assembly processes, including pick-and-place, die attach, wire bonding, or flip chip
- Knowledge of SECS/GEM data streams and SEMI standards for equipment performance tracking
- Experience with first-of-a-kind (FOK) tools for new technology insertion and supplier collaboration
Background in statistical analysis using tools like JMP, Minitab, or Python/pandas
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $155,520.00-298,440.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in mechanical engineering, chemical engineering, materials science, electrical engineering, physics, or a related STEM field with 9+ years of relevant experience
- Master's degree in a related STEM field with 6+ years of relevant experience
- PhD in a related STEM field with 4+ years of relevant experience
- Experience with semiconductor processing, wafer-level assembly, or cleanroom environments
- Experience with process development methodologies, statistical process control, and manufacturing process improvement
- Hands-on experience with module engineering, equipment troubleshooting, and preventive maintenance procedures
- 10+ years of experience leading process development programs from strategy formation through high-volume production
- Direct experience with semiconductor assembly processes, including pick-and-place, die attach, wire bonding, or flip chip
- Knowledge of SECS/GEM data streams and SEMI standards for equipment performance tracking
- Experience with first-of-a-kind tools for new technology insertion and supplier collaboration
- Statistical analysis experience using JMP, Minitab, or Python/pandas
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
Intel Insights
What We Do
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.
