Technology Leader, Advanced Product Engineering

Reposted 5 Days Ago
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Livermore, CA, USA
In-Office
192K-253K Annually
Expert/Leader
Hardware • Semiconductor • Quantum Computing • Manufacturing
The Role
Lead development and delivery of advanced cooling solutions for probe card technologies. Define thermal strategy and roadmap, manage and scale engineering teams, drive product development using PLC methodology, coordinate cross-functional prototyping and manufacturing, resolve critical product issues, and deliver program outcomes for schedule, cost, and technical performance.
Summary Generated by Built In

Forming Our Future together

FormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle — from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America.

Rooted in our core values — Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People — we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it's improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter.

Shift:

The regular hours for this position are day shift.

Job Description:

The Technology Leader OR Director, Advanced Product Engineering will drive the development and delivery of advanced cooling solutions for probe card technologies. This role is responsible for defining technical vision and roadmap for thermal solutions, leading multiple engineering efforts, and ensuring alignment with product, manufacturing, and business objectives.

The individual will lead and scale a high-performing engineering team, develop critical capabilities, and drive innovation in cooling architectures for next generation semiconductor test systems. Success in this role requires a balance of deep domain expertise, organizational leadership, and the ability to influence across functions and levels.

Key Responsibilities:

  • Lead the architecture, design, and development of cooling solutions for probe card technologies.

  • Define and own thermal technology strategy and multi-year roadmap aligned to business objectives.

  • Lead, develop, and scale a team of engineers.

  • Drive resource planning, prioritization, and organizational design to support product and technology goals.

  • Establish and track business and engineering Key Performance Indicators (KPIs) and manage development programs using Product Life Cycle (PLC) methodology.

  • Develop and evaluate new concepts for heat removal, temperature uniformity, and thermal stability.

  • Ensure organization has the technical rigor to execute development and implementation of solutions for highly complex product and engineering challenges.

  • Technically lead and/or execute engineering projects and spearhead research and development of new technologies, as appropriate.

  • Lead escalation resolution for critical product and customer issues. Interface with internal and external stakeholders to resolve complex engineering issues and meet customer commitments.

  • Collaborate with manufacturing to build prototypes, alpha and beta probe cards.

  • Drive continuous improvement across development process, manufacturability, and reliability. Own delivery of complex programs including schedule, cost, and technical performance outcomes.

Preferred Experience:

  • MS or Ph.D. in Mechanical Engineering, or a related engineering field preferred; BS with significant relevant experience will also be considered.

  • 10+ years of relevant experience in thermal management, electronics cooling, semiconductor equipment, or related advanced product development environments.

  • Demonstrated success leading engineering teams in semiconductor, electronics cooling, or related industries.

Skills:

3D Modeling, Agile Systems, AutoCAD 3D, Business Acumen, Communication, Computational Fluid Dynamics (CFD), Cross-Functional Collaboration, Cross-Functional Leadership, Engineering Leadership, Error Budgets, FEA Software, Geometric Dimensioning And Tolerancing (GD&T), Heat Transfers, Interpersonal Communication, Leadership, MATLAB, Problem Solving, Product Development, Python (Programming Language), Semiconductor Manufacturing, SolidWorks, Technology Strategy Development, Thermal Management, Thermomechanical Processing

Education & Experience:

Minimum of 12+ years of relevant experience in leadership roles, with a Bachelor’s degree; or 10 years and a Master’s degree; or a PhD with 8 years experience; or equivalent experience | Required

Pay Range:

$192,400.00 - $252,525.00

Pay Range Explained:

This role in Livermore, California pays between $192,400.00 and $252,525.00 per year, depending on your experience, skills, and background. Pay may vary in other locations. We offer a full benefits package, including medical, dental, vision, life insurance, disability coverage, a 401(k) with company match, employee stock purchase plan (ESPP), and paid time off. You’ll also be eligible for quarterly profit-sharing bonuses and flexible spending or savings accounts.

Equal Employment Opportunity Statement

FormFactor is an equal opportunity employer. FormFactor complies with all national, state, and local laws that seek to promote equal opportunities for any applicant or employee without regard to age, race, color, gender, gender identity/expression, national origin, sexual orientation, religion, disability, marital status, pregnancy or related condition, military service, or any other legally protected characteristics. These protections apply to all aspects of employment, including but not limited to, recruitment, hiring, training, promotions, and compensation.

For roles that are designated as remote-eligible, employees cannot be located in: AL, AK, AR, DE, GA, HI, IL, IA, KY, LA, ME, MD, MS, MO, NE, NV, NJ, NM, ND, OK, PA, RI, SC, SD, TN, WV, WI, WY. This list is continuously evolving and being updated, please check back with us if the state you live in is on the exclusion list. A role is remote-eligible only when it is listed as "Remote" in the job location.

Skills Required

  • Minimum of 12+ years leadership experience (or 10 years with MS, or 8 years with PhD) in thermal management, electronics cooling, semiconductor equipment, or related product development
  • Bachelor's degree in Mechanical Engineering or related engineering field (or equivalent experience)
  • Experience leading and scaling engineering teams, including resource planning and organizational design
  • Demonstrated experience designing and delivering cooling solutions for probe cards or semiconductor test systems
  • Proficiency with Computational Fluid Dynamics (CFD) and FEA software for thermal analysis
  • Experience with SolidWorks and AutoCAD 3D or comparable 3D modeling tools
  • Strong knowledge of heat transfer, thermal stability, temperature uniformity, and thermomechanical processing
  • Experience with GD&T, prototyping, manufacturability, and collaborating with manufacturing teams
  • Experience managing complex product development programs using Product Life Cycle (PLC) methodology and KPIs
  • Proficiency in MATLAB and Python for analysis and modeling
  • MS or PhD in Mechanical Engineering or related field
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The Company
HQ: Livermore, CA
1,903 Employees
Year Founded: 1993

What We Do

FormFactor, Inc. is a leading provider of essential test and measurement technologies for the semiconductor industry, offering products like probe cards, analytical probes, and cryogenic systems to support the full integrated circuit (IC) life cycle.

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