We offer amazing opportunities to grow, no matter where you are in your career.
Key Responsibilities
1. Business Development & IP Sales
Drive IP licensing growth in China, with a strong focus on Tensilica CPU technologies.
Engage with SoC teams in automotive, AR/VR, mobile, smart speakers, TWS, and broader consumer markets.
Identify and qualify new business opportunities, expand existing accounts, and manage the full sales cycle.
Understand customer architecture requirements, future roadmaps, and competitive offerings to position Tensilica IP effectively.
Work closely with China sales teams to develop and execute regional account strategies.
2. Software Partner Ecosystem Management
Build, develop, and nurture relationships with key software vendors, including:
AI/ML algorithm developers
Audio/voice/ANC/beamforming software vendors
Vision and XR software developers
Automotive middleware and safety‑related software providers
Advocate Tensilica IP by driving:
Partner onboarding
Technical enablement
Performance optimization
Joint solution and reference design development
Expand the breadth of use cases supported on Tensilica IP, including:
AI inferencing
Audio/voice processing
Sensor fusion
XR/AR acceleration
Always‑on, low‑power workloads
3. Collaboration with China Sales & FAE Teams
Work hand‑in‑hand with the China sales organization to coordinate account strategies and engagement plans.
Partner closely with FAE teams to:
Support technical evaluations
Manage benchmarking activities
Drive proof‑of‑concept engagements
Resolve technical blockers that influence purchasing decisions
Provide feedback from customers and partners to guide product planning and roadmap decisions.
4. Market Intelligence & Strategic Planning
Develop China‑specific go‑to‑market strategies for automotive and consumer segments.
Monitor industry trends, emerging workloads, regulatory standards, and local ecosystem shifts (software and hardware).
Represent the company at China industry conferences, partner workshops, customer summits, and semiconductor forums.
Qualifications
Required
Bachelor’s or Master’s in Electrical Engineering, Computer Engineering, or related discipline.
10+ years of experience in semiconductor IP, DSP/CPU/NPU technologies, SoC design, embedded software, or related business development roles.
Strong technical understanding of CPU architectures, signal processing, embedded systems, and AI workloads.
Proven success selling semiconductor IP or building technical business engagements in China.
Familiarity with software ecosystems in audio, voice, AI/ML, AR/VR, and automotive domains.
Excellent communication, negotiation, and relationship‑building skills.
Ability to travel within China and internationally.
Preferred
Direct experience with RISC-V or ARM or similar configurable CPU architectures.
Existing relationships with:
China automotive SoC vendors
Smartphone/IoT/CE chipmakers
AR/VR and edge‑AI solution developers
Leading software algorithm partners
Understanding of heterogeneous compute architectures, low‑power SoC design, or automotive functional safety (e.g., ISO26262).
Be proud and passionate about the work you do. Together, our One Cadence -- One Team culture drives our success.
We’re doing work that matters. Help us solve what others can’t.Skills Required
- Bachelor's or Master's in Electrical Engineering, Computer Engineering, or related discipline
- 10+ years of experience in semiconductor IP, DSP/CPU/NPU technologies, SoC design, embedded software, or related business development roles
- Strong technical understanding of CPU architectures, signal processing, embedded systems, and AI workloads
- Proven success selling semiconductor IP or building technical business engagements in China
- Familiarity with software ecosystems in audio, voice, AI/ML, AR/VR, and automotive domains
- Excellent communication, negotiation, and relationship-building skills
- Ability to travel within China and internationally
- Direct experience with RISC-V or ARM or similar configurable CPU architectures
- Existing relationships with China automotive SoC vendors, smartphone/IoT/CE chipmakers, AR/VR and edge-AI developers, or leading software algorithm partners
- Understanding of heterogeneous compute architectures, low-power SoC design, or automotive functional safety (e.g., ISO26262)
Cadence Design Systems Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Cadence Design Systems and has not been reviewed or approved by Cadence Design Systems.
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Equity Value & Accessibility — A discounted ESPP with a lookback feature and equity included in total compensation make ownership broadly accessible and potentially meaningful. Structured compensation at an industry leader adds predictability to equity participation.
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Healthcare Strength — Medical, dental, and vision coverage are described as solid, with mental‑health/EAP and fertility support enhancing the offering. The breadth across core care and family‑building needs strengthens the healthcare package.
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Leave & Time Off Breadth — Global Recharge Days, volunteer time off, and companywide breaks indicate a comprehensive time‑off framework. In addition, many salaried roles are described as having flexible or generous PTO policies.
Cadence Design Systems Insights
What We Do
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and IP are used by customers to deliver products to market faster. The company's Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to intelligent systems—in mobile, consumer, cloud, data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For.
