Summer 2026 - Physical Failure Analysis Intern

An internship at onsemi offers a dynamic opportunity to gain hands-on experience through real-world projects that drive innovation in the semiconductor industry. Interns are entrusted with meaningful responsibilities and exposed to cutting-edge technologies, fostering both technical skill development and professional growth.

onsemi views internships as a strategic pipeline for entry-level career positions, providing a collaborative and inclusive environment where interns work alongside diverse teams and contribute to high-impact initiatives. The company’s commitment to sustainability, including its goal of achieving net-zero emissions by 2040, enables interns to engage in projects that align with global environmental priorities.

Key benefits include:

• Competitive compensation and medical benefits
• Flexible work hours aligned with academic schedules
• Access to Employee Resource Groups (ERGs) which foster a sense of belonging and provide opportunities for mentorship and community engagement
• Networking events, professional development workshops, and project showcases that build career readiness and visibility across the organization

Internship roles span multiple disciplines including engineering, business operations, data analytics, and finance, and are designed to align with onsemi’s strategic goals of innovation and workforce development. Structured programs such as rotational field sales and finance analyst tracks offer additional career pathways for interns transitioning into full-time roles.

The onsemi Tempe Product Analysis Lab is seeking a highly motivated Physical Failure Analysis Intern to support product-level physical failure analysis activities. This position provides hands-on experience with semiconductor devices and analytical methods used to determine root cause of failures observed in customer returns, product qualifications, and new product development. The intern will work under the guidance of experienced engineers and analysts to perform device preparation, operate lab equipment, collect analytical data, and assist in documenting findings. The specific project scope will be defined based on business needs and the intern’s technical background.

Typical Responsibilities

• Assist in performing physical failure analysis on semiconductor devices across multiple product lines.
• Conduct sample preparation including mechanical and chemical decapsulation, cross-sectioning, polishing, and related processes.
• Support operation of analytical equipment and associated sample prep tools related to optical and electron microscopy, X-ray/CT inspection, thermal analysis, and chemical characterization.
• Document analytical steps, observations, images, and preliminary results in accordance with lab standards.
•  Support investigations on customer returns (RMAs), qualification failures, and new-product-development failures.
•  Maintain adherence to all safety procedures, laboratory protocols, and equipment handling requirements.
•  Assist with report generation, data organization, and communication of findings to engineering stakeholders.
• Contribute to continuous improvement initiatives related to lab processes, documentation, and workflow efficiency.

• Currently pursuing a Bachelor’s or Master’s degree in Materials Science, Physics, Chemistry, or a related technical field.
• Demonstrated interest in semiconductor devices, materials, or failure analysis.
• Strong attention to detail and ability to follow established procedures.
• Effective written and verbal communication skills.
• Ability to work both independently and collaboratively in a laboratory environment.

• Coursework or prior experience in semiconductor device physics, microelectronics, reliability engineering, or materials characterization. Exposure to microscopy techniques or mechanical/chemical sample preparation.
• Experience writing technical reports or maintaining structured documentation.
• Prior hands-on laboratory experience is a plus.

• This internship provides exposure to:
• Industry-standard physical failure analysis techniques and workflows.
• Advanced analytical instrumentation used in semiconductor diagnostics.
• Root-cause determination methods and structured problem-solving practices.
• Cross-functional collaboration with product engineering, reliability, and quality teams.