The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology Integration Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers.
In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners.
Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives.
Responsibilities
- Collaborate with suppliers and internal engineering teams to develop robust building block processes across component embedding, core fabrication, laser drilling, dielectric lamination, lithography, electrolytic multi metal plating, defect inspection/metrology, electrical testing, and other substrate technologies.
- Partner closely with on site supplier engineering teams and the APTD Substrate Integration team to advance substrate building block technologies and manage critical process interactions.
- Ensure suppliers meet all Product Control System (PCS) commitments with rigor and consistency.
- Work with cross functional teams to design and implement new factory technology validation and product certification plans focused on yield improvement.
- Develop and maintain detailed micro schedules for new factory startup activities, including key milestones, to ensure supplier alignment with startup timelines.
- Lead qualification activities and monitor ramp indicators to enable an incident free production ramp and successful introduction of new capacity.
Minimum Qualifications
- Bachelor's degree with 6+ years of experience, OR Master's degree with 4+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.
Experience listed above should be in the following:
- Statistical tools and methods, including Statistical Process Control (SPC) for yield improvement. .
- Experience managing complex projects and deliver results in high-volume manufacturing environments.
Preferred Qualifications
- A strong foundation in advanced packaging, substrates, or semiconductor manufacturing; proven leadership in supplier management or technology enablement; and the ability to drive alignment and execution across global teams.
- Proven ability to thrive in high-ambiguity environments and deliver results under pressure. Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies.
- Experience with process flow development, FMEA, DOE design, and problem-solving tools.
Job Type:Experienced HireShift:Shift 1 (Korea, Republic of)Primary Location: South Korea, SeoulAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree with 6+ years, OR Master's with 4+ years, OR PhD with 2+ years in Mechanical, Materials, Chemical, Electrical Engineering, Physics, or related
- Experience with statistical tools and methods, including Statistical Process Control (SPC)
- Experience managing complex projects and delivering results in high-volume manufacturing environments
- Ability to collaborate with suppliers and support periodic evening meetings with East Asia suppliers and occasional supplier site travel
- Knowledge of advanced packaging, substrates, or semiconductor manufacturing and supplier management/technology enablement
- Experience with process flow development, FMEA, DOE design, and problem-solving tools
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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