Substrate Design Engineer

About the role

The design engineer is responsible for generating the System In Package (SiP) Package and Substrate design for that meet development project functional requirement specification (FRS) and excellent for manufacturing.

What you will do

New SiP Package and Substrate design

• Design and develop substrate layouts for System-in-Package (SiP) solutions, including high-speed, high-density interconnects.

• Collaborate with IC design, PCB substrate, signal integrity (SI/PI), thermal, and manufacturing teams to optimize package performance.

• Work with foundries, assembly site , and suppliers to define manufacturing requirements and ensure DFM (Design for Manufacturability).

• Support prototyping, validation, and troubleshooting during product development.

• Identify gaps between design requirement and supplier capability timely

• Identify technical risk and provide mitigation proposal at the right time with making use of design tools: Design FMEA, simulations

• Drive for sound solutions

Owner of Substrate design process

• Ensure the process is effectively implemented across the whole development life cycle

• Define substrate stack-up, materials, routing, and design rules for advanced package architectures.

Maintain the SiP Package and Substrate design rule that correctly reflect the assembly capabilities and SiP Product requirements

• Develop and maintain design documentation, BOMs, and layout databases

What you will need

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.

• Sound knowledge of SiP package design

• Proficiency in substrate/package design tools (e.g., Cadence Allegro Package Designer, Mentor Xpedition, Ansys Siwave, AutoCAD).

• Strong knowledge of signal integrity (SI), power integrity (PI), thermal analysis, and package reliability.

• Familiarity with advanced packaging technologies (FC-BGA, 2.5D, 3D IC, RDL, embedded passives, etc.).

• Proficiency in BOM selection and their relationship in final product quality, reliability and performance during package design phase

• Strong customer focus, proactive and able to work with minimum supervision

• Creative in new ideas and solutions

• Good interpersonal and presentation skills in cross-functional team

• Good command of written and spoken Mandarin and English

• Willing to travel in occasion

• Experience required: 

• At least 8 years in Mechanical Design
• At least 10 years in semiconductor industry

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.