Staff Software Engineer

Reposted 8 Days Ago
Be an Early Applicant
San Jose, CA, USA
Hybrid
180K-245K Annually
Expert/Leader
3D Printing
The Role
Lead hardware/software bring-up of analog/mixed-signal and sensor ICs on customer MCUs/SoCs. Write driver-level firmware and application demos, debug full signal-chain issues, build reusable driver frameworks, document architectures and bring-up guides, lead technical integrations with partners, mentor engineers, and support customer lab demos and trade-show deadlines.
Summary Generated by Built In
Job Description

Why This Role Matters

Renesas AMS is in the middle of a strategic push to become the sensor and signal-chain vendor of choice inside the fastest-growing platforms in robotics, AI infrastructure, and automotive. That strategy lives or dies on whether we can walk into a customer's lab, integrate our silicon onto their compute platform, and prove it works, fast, credibly, and in code the customer's own engineers trust.

This role is the technical engine behind that proof. You will be the person who takes an inductive position sensor, an impedance-sensing IC, or a configurable mixed-signal device and makes it run on a customer's MCU or SoC, whatever that platform happens to be. This work feeds directly into design win conversations with strategic accounts across robotics, AI infrastructure, and automotive.

What You'll Actually Do

  • Own hardware/software bring-up of AMS and sensor ICs on customer-selected compute platforms, with no assumption of a friendly Renesas reference design.
  • Write driver-level firmware in C/C++ (I2C, SPI, UART, GPIO, interrupt handling, register-level configuration) directly from datasheets and schematics, often for silicon and platforms outside Renesas's own ecosystem.
  • Build application-layer demonstration code proving out specific end-use cases: optical encoder replacement via inductive position sensing, through-barrier impedance sensing, power sequencing, force/torque sensing for robotic end effectors.
  • Lead technical integration for flagship joint development programs (e.g., dexterous robotic hands, industrial robotic arms) alongside strategic partners, working against hard trade-show and customer deadlines.
  • Debug full signal-chain issues spanning analog front end, digital bus, and host software stack, often live, in a customer's lab.
  • Partner directly with FAEs, product marketing, business development, and customer engineering counterparts to scope PoC requirements, define technical success criteria, and hit milestones that feed directly into account strategy.
  • Build reusable driver frameworks and reference architectures that scale across engagements rather than one-off, throwaway integrations.
  • Represent Renesas technically in front of customer engineering leadership during lab visits and demos.
  • Produce clear technical documentation (architecture, register maps, bring-up guides) usable by both internal teams and customer engineers.
  • At the Staff level: provide technical mentorship to other engineers on the team and act as the escalation point for the most technically ambiguous or highest-stakes customer integrations.

Qualifications

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field, or equivalent hands-on experience.
  • Senior: 7+ years, Staff: 10+ years, of embedded firmware/software development spanning multiple silicon vendors and MCU/SoC ecosystems.
  • Strong, demonstrable C/C++ skill at both the driver and application level, not just familiarity.
  • Direct experience bringing up analog/mixed-signal ICs and sensors on third-party platforms you didn't design, from datasheet and schematic alone.
  • Deep protocol-level command of I2C, SPI, UART, and Ethernet-based interfaces.
  • Experience developing in both bare-metal and RTOS environments.
  • Comfort operating under ambiguity: incomplete documentation, shifting customer requirements, and hard external deadlines tied to trade shows or executive commitments.
  • Strong communication skills; you'll be explaining technical tradeoffs to both engineers and non-technical stakeholders, sometimes in the same meeting.
  • Willingness to travel up to 20% for customer lab visits and trade shows.

Preferred Qualifications

  • Master's degree in a related engineering field.
  • Robotics or industrial sensing background: position sensing, force/torque sensing, proximity/impedance sensing.
  • Experience with edge AI compute platforms and their SDK/driver ecosystems.
  • Exposure to configurable mixed-signal/state-machine-based analog design.
  • Prior customer-facing technical role: FAE, solutions architect, or applications engineering.
  • Python for test automation, data logging, or tooling alongside embedded C/C++.
  • Experience mentoring junior or mid-level engineers.
  • Experience working inside a matrixed organization with cross-functional stakeholders across sales, marketing, and engineering.

Additional Information

The expected annual pay range for this position is $180,000 - $245,000. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Skills Required

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field, or equivalent hands-on experience.
  • 10+ years of embedded firmware/software development spanning multiple silicon vendors and MCU/SoC ecosystems.
  • Strong, demonstrable C/C++ skill at both the driver and application level.
  • Direct experience bringing up analog/mixed-signal ICs and sensors on third-party platforms from datasheet and schematic.
  • Deep protocol-level command of I2C, SPI, UART, and Ethernet-based interfaces.
  • Experience developing in both bare-metal and RTOS environments.
  • Comfort operating under ambiguity: incomplete documentation and shifting customer requirements.
  • Strong communication skills for technical and non-technical stakeholders.
  • Willingness to travel up to 20% for customer lab visits and trade shows.
  • Master's degree in a related engineering field.
  • Robotics or industrial sensing background (position, force/torque, proximity/impedance sensing).
  • Experience with edge AI compute platforms and their SDK/driver ecosystems.
  • Exposure to configurable mixed-signal/state-machine-based analog design.
  • Prior customer-facing technical role (FAE, solutions architect, applications engineering).
  • Python for test automation, data logging, or tooling alongside embedded C/C++.
  • Experience mentoring junior or mid-level engineers.
  • Experience working inside a matrixed organization with cross-functional stakeholders.

Renesas Electronics Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.

  • Fair & Transparent Compensation Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
  • Healthcare Strength Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
  • Leave & Time Off Breadth Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.

Renesas Electronics Insights

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The Company
HQ: Tokyo
10,040 Employees

What We Do

We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.

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