Location: We are open to hiring in either Chandler, AZ or San Jose, CA.
Responsibilities:
- Drive SI design, modeling, simulation, and validation across SoC, advanced 2.5D/3D packaging, PCB, and system-level interconnects!
- Perform high-speed channel analysis and optimization for DDR5/LPDDR, PCIe/CXL, Ethernet, die-to-die (D2D), and next-generation SerDes interfaces.
- Develop and validate electromagnetic (EM), S-parameter, IBIS/IBIS-AMI, and behavioral models for chip-to-chip and chip-to-memory interfaces.
- Lead signal integrity optimization, including insertion loss, return loss, crosstalk, impedance discontinuities, equalization, and BER-based eye-margin analysis.
- Collaborate with silicon PHY, package, PCB, architecture, and validation teams to drive SI design guidelines, simulation-to-silicon correlation, and electrical sign-off.
- Support advanced packaging technologies, including chiplets, interposers, high-density substrates, and heterogeneous integration.
Required Skills and Experience :
- BS/MS/Ph.D. in Electrical Engineering or a related field.
- 8+ years of experience in high-speed signal integrity engineering, semiconductor packaging, or system-level electrical design.
- Strong expertise in SI simulation and 3D electromagnetic modeling tools such as Ansys HFSS, SIwave, Keysight ADS, or equivalent.
- Solid understanding of high-speed I/O signaling, transmission lines, S-parameters, crosstalk, equalization, and timing/BER analysis.
- Experience with advanced packaging, DDR/LPDDR memory interfaces, PCIe/CXL, and high-speed SerDes technologies.
- Strong analytical, problem-solving, and multi-functional teamwork skills.
"Nice To Have" Skills and Experience :
Experience with AI/HPC supercomputing platforms, advanced chiplet integration, package-to-board co-design, silicon bring-up, and simulation-to-measurement correlation.
Salary Range:
$209,100-$282,900 per year
We value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm's offering. The total reward package will be shared with candidates during the recruitment and selection process.
Our 10x Mindset
At Arm, we believe progress happens when people are empowered to think bigger and push beyond what seems possible. Our 10x mindset is about curiosity, ambition and creating impact that will be used by millions. We learn fast, prioritise collaboration and turn bold ideas into real technology. We look for people who are inspired by this way of working and want to grow in an environment where bold ideas are welcomed. Discover how the 10x mindset shapes life at Arm: https://careers.arm.com/10x-mindset
Use of AI in Your Application
At Arm, we embrace the benefits AI can bring, including in recruitment. You may use AI to support your preparation, such as improving the clarity of written responses, practicing interview questions, or learning more about our industry. However, your application and interview responses must reflect your own thinking, experience, and abilities. We want to understand your authentic perspective, creativity, and approach to problem solving. As such, you may not use AI to complete assigned tasks as part of any assessments. If you plan to use AI-supported or assistive technologies as part of a reasonable adjustment, please contact [email protected] so we can support you.
Recruitment Adjustments and Accommodations
At Arm, we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process, please email [email protected] . To note, by sending us the requested information, you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality, and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list, examples of support include breaks between interviews, having documents read aloud, or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.
Hybrid Working
Arm's approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team's needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.
Equal Opportunities
Arm is an equal opportunity employer, committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals, and don't discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.
Skills Required
- BS, MS, or PhD in Electrical Engineering or a related field
- 8+ years of experience in high-speed signal integrity engineering, semiconductor packaging, or system-level electrical design
- Expertise in signal integrity simulation and 3D electromagnetic modeling tools such as Ansys HFSS, SIwave, or Keysight ADS
- Understanding of high-speed I/O signaling, transmission lines, S-parameters, crosstalk, equalization, and timing/BER analysis
- Experience with advanced packaging, DDR/LPDDR memory interfaces, PCIe/CXL, and high-speed SerDes technologies
- Strong analytical, problem-solving, and multifunctional teamwork skills
- Experience with AI/HPC supercomputing platforms, advanced chiplet integration, package-to-board co-design, silicon bring-up, and simulation-to-measurement correlation
What We Do
We bring brilliant people together in a global ecosystem that is sparking the world’s potential. Arm technology enables specialized processing built on the economics, design freedom and accessibility of general-purpose compute that has, so far, led to more than 180 billion chips being shipped by our partners.
Why Work With Us
At Arm, we build the future of computing, powering everything from smartphones to AI. Our 10x mindset drives bold thinking and deep collaboration to solve complex problems together. With a people first culture, flexible work, and strong support for growth and wellbeing, your ideas can make a global impact while your career thrives.
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Arm Offices
Hybrid Workspace
Employees engage in a combination of remote and on-site work.