Sustaining Staff Product Package Engineers ensures product continuity after mass production by manage SPS, controllers and various AI products lifecycle, resolving production, package, process issues, and improving COGS. We are seeking a Package Expert to join our team with a primary focus on sustaining engineering activities. This role is critical in ensuring the long-term quality, reliability, and manufacturability of our power IC products. The ideal candidate will collaborate with cross-functional teams—including design, test, manufacturing, package and quality—to support mature products in high-volume production, drive package design improvement, resolve customer issues, and extend product lifecycle.
Key Responsibilities
- Product owner to multiple products lifecycle.
- Oversees high volume AI Products mass production assembly line readiness, manufacturing execution across all internal factory and subcons
- Monitor and resolve manufacturing issues, working closely with fab, assembly, and test sites.
- Sustaining Product COGS improvement and process optimization such as Yield/Volume/Test Time/failure improvements. Improve Test process and prevent potential quality excursions.
- Manage and mitigate risk in MRB / PCRB (Process Change Review Board) to keep delivery by supporting product qualifications, second-source/material changes, and process migrations/improvements.
- Cross function interface with Operation, QA, Reliability, Factory and OSAT.
Requirements:
- Proven track record of successful Package Development execution and/or Assembly line introduction for high volume mass production manufacturing factory and subcons
- At least have a minimum of 5 years’ experience in package development and process engineering
- Bachelor's Degree Engineering in Mechanical, Electrical/Electronic, Physics, Materials or related fields
- Experience in product ramp execution, bill of material readiness equipment capacity planning, process optimization and prevent potential quality excursions.
- Experienced in process engineering or package development of material/process/design
- Experience in CuClip thin die assembly processes, SPS solder attach processes.
- Highly self-motivated, adaptable and good time management skill
- Proficient in Data manipulation and analysis skill. Familiar with JMP, PDF Exenso is a plus.
- Need to work onsite.
- Must have good verbal and written communication skills in English.
- Good interpersonal, communication, and collaboration skills.
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Skills Required
- Minimum 5 years experience in package development and process engineering
- Bachelor's Degree in Mechanical, Electrical/Electronic, Physics, Materials or related field
- Proven track record of successful package development execution and/or assembly line introduction for high-volume mass production
- Experience in product ramp execution, bill of material readiness, equipment capacity planning, and process optimization
- Experience in process engineering or package development of material/process/design
- Experience in CuClip thin die assembly processes
- Experience in SPS solder attach processes
- Proficient in data manipulation and analysis
- Familiarity with JMP and PDF Exenso
- Ability to work onsite
- Good verbal and written English communication and collaboration skills
Renesas Electronics Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.
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Fair & Transparent Compensation — Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
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Healthcare Strength — Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
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Leave & Time Off Breadth — Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.
Renesas Electronics Insights
What We Do
We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.
