Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.
Key Responsibilities
- Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
- Ramp up manufacturing volume and qualify required sources.
- Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
- Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
- Manage Product Lifecycle Management documents to the latest status.
- Conduct change-management with suppliers to sustain / improve capacity and cost.
- Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
- Serve as the key manufacturing engineering interface for NPI-to-production transfers.
- Manage OSAT and contract manufacturing relationships supporting production.
- Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
- Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
- Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
- Knowledge of wire bonding.
- Knowledge of SPC and statistical analysis software (such as JMP).
- Strong interpersonal and communication skills in English.
- Strong analytical, written communication and presentation skills. Able to manage large projects effectively.
Nice to haves:
- Cu Clip, Thin Die, Power QFN
- Package development knowledge
- Experience transitioning products from Development to Production
- Experience supporting NPI to Mass Production
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Skills Required
- Bachelor’s degree in Mechanical Engineering, Materials, Physics, Chemistry, or Applied Sciences
- Experience in process engineering or package development involving thin wafer handling and SPS solder attach processes
- Knowledge of quality and reliability requirements for PQFN, QFN, WLCSP, and leaded packages
- Knowledge of wire bonding
- Knowledge of statistical process control and statistical analysis software such as JMP
- Strong interpersonal and English communication skills
- Strong analytical, written communication, and presentation skills
- Ability to manage large projects effectively
- Knowledge of Cu Clip, thin die, and Power QFN
- Package development knowledge
- Experience transitioning products from development to production
- Experience supporting NPI to mass production
Renesas Electronics Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.
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Fair & Transparent Compensation — Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
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Healthcare Strength — Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
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Leave & Time Off Breadth — Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.
Renesas Electronics Insights
What We Do
We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.
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