The Package Development Engineer is responsible for developing, qualifying, and industrializing semiconductor package solutions that meet product performance, reliability, manufacturability, cost, and schedule requirements. This role works closely with cross-functional teams, including silicon design, package design, manufacturing, reliability, quality, and OSAT partners to bring new package technologies from concept through high-volume manufacturing.
The ideal candidate combines strong semiconductor packaging expertise with a hands-on, problem-solving mindset and the ability to drive complex technology development activities in a global environment.
Qualifications- Bachelor's degree in Packaging Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline.
- Minimum 5+ years of experience in semiconductor package development, package integration, or advanced packaging technologies.
- Strong knowledge of semiconductor assembly processes, including,
- Wafer backgrind
- Wafer dicing
- Die attach
- Flip-chip assembly
- Wire bonding
- Underfill
- Encapsulation and molding
- Ball attach
- Package singulation
- Surface-mount technology (SMT)
- Experience developing and qualifying semiconductor packages in collaboration with OSAT partners.
- Knowledge of Design of Experiments (DOE), statistical analysis, and structured problem-solving methodologies.
- Experience conducting package reliability testing, failure analysis, and root-cause investigations.
- Strong analytical, project management, and communication skills.
- Ability to work independently and effectively within cross-functional global teams.
Preferred Qualifications
- Master's degree or Ph.D. in Packaging Engineering, Mechanical Engineering, Materials Science, Physics, Chemistry, or a related field.
- Experience with advanced packaging technologies such as:
- Flip-Chip CSP (FCCSP)
- System-in-Package (SiP)
- Fan-Out Packaging (FOPLP/FOWLP)
- Wafer-Level Packaging (WLP/WLCSP)
- 2.5D/3D Packaging
- Knowledge of package thermal, mechanical, and electrical characterization techniques.
- Experience supporting automotive-grade product qualification and reliability standards.
- Knowledge of sustainability initiatives, packaging materials selection, and cost optimization techniques.
Education/Experience:
Ph.D. - 2 plus years relevant industry experience
Master's Degree - 5 plus years relevant industry experience
Bachelor's Degree - 7 plus years relevant industry experience
Key Competencies:
- Strong technical problem-solving skills
- Engineering rigor and attention to detail
- Innovation and research mindset
- Project ownership and execution
- Cross-functional leadership
- Vendor and supplier management
- Effective technical communication
- Ability to thrive in a fast-paced development environment
- Continuous learning and improvement orientation
Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
Skills Required
- Bachelor's degree in Packaging, Mechanical, Materials, Chemical, Physics, Electrical Engineering, or related technical discipline
- Minimum 5+ years experience in semiconductor package development, package integration, or advanced packaging technologies
- Strong knowledge of semiconductor assembly processes (wafer backgrind, wafer dicing, die attach, flip-chip, wire bonding, underfill, encapsulation/molding, ball attach, package singulation, SMT)
- Experience developing and qualifying semiconductor packages in collaboration with OSAT partners
- Knowledge and application of Design of Experiments (DOE), statistical analysis, and structured problem-solving methodologies
- Experience conducting package reliability testing, failure analysis, and root-cause investigations
- Strong analytical, project management, and technical communication skills
- Ability to work independently and effectively within cross-functional global teams
- Master's degree or Ph.D. in relevant field
- Experience with advanced packaging technologies (FCCSP, SiP, Fan-Out FOPLP/FOWLP, WLP/WLCSP, 2.5D/3D Packaging)
- Knowledge of package thermal, mechanical, and electrical characterization techniques
- Experience supporting automotive-grade product qualification and reliability standards
- Familiarity with sustainability initiatives, packaging materials selection, and cost optimization techniques
Renesas Electronics Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.
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Fair & Transparent Compensation — Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
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Healthcare Strength — Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
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Leave & Time Off Breadth — Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.
Renesas Electronics Insights
What We Do
We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.
