Staff Package Design Engineer

Posted 5 Days Ago
Be an Early Applicant
Austin, TX, USA
Hybrid
Senior level
Hardware • Software
Cirrus Logic's technology elevates the consumer experience for the world's top mobile and consumer applications.
The Role
The Staff Package Design Engineer will develop packaging solutions, collaborate with cross-functional teams, and ensure design rules are met while improving processes and efficiency in the design flow.
Summary Generated by Built In
For over four decades, Cirrus Logic has been propelled by the top engineers in mixed-signal processing. Our rockstar team thrives on solving complex challenges with innovative end-user solutions for the world's top consumer brands. Cirrus Logic is also known for its award-winning culture, which was built on a foundation of inclusion and fairness, meaningful community engagement, and delivering enjoyable employee experiences at every turn. But we couldn’t do it without our extraordinary workforce – and that’s where you come in. Join our team and help us continue to make Cirrus Logic an exceptional place to grow your career! 

Are you ready to make a significant impact in a fast-paced, innovative environment?

We are seeking a Staff Package Design Engineer to join our dynamic team in Austin, TX. In this role, you’ll work closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs.

Responsibilities

  • Collaborate with cross-functional teams to drive package designs that meets Cirrus performance, reliability, and manufacturability requirements
  • Define package requirements from electrical, thermal, and mechanical point of view in close cooperation with Design and layout teams
  • Utilize AutoCAD, GDS tools, Siemen Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information
  • Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB
  • Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages
  • Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues
  • Grow and promote automation processes throughout the package design flow
  • Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance
  • Close collaboration with customers to resolve various design issues between the piece part and PCB

Required Skills and Qualifications

  • BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
  • 7+ years of experience in a package design engineering or related role
  • Demonstrable experience in a packaging-related field
  • Experienced Cadence SiP layout user 
  • Strong AutoCAD user
  • Knowledge of packaging technologies, materials, package substrate design and assembly rules
  • Understanding of electrical simulation results on a package design
  • Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations
  • Strong written and verbal communication skills; able to review technical ideas with customers and high-level management
  • Self-starter with a strong sense of ownership and accountability for driving projects to completion
  • Ability to build strong, influential relationships in a collaborative environment within a diverse setting

Preferred Skills and Qualifications

  • Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)
  • Broad reading in the area of interest and the desire to continue that reading with access to the high quality company library resource, material properties knowledge
  • Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training opportunities available through company resources
  • Electrical simulation skills
  • Experience using Siemens Fast 3D
  • Experience using Siemens Calibre DRV

#LI-CC1 #LI-Hybrid

Export control restrictions based upon applicable laws and regulations would prohibit candidates who are nationals of certain embargoed countries from working in this position without Cirrus Logic first obtaining an export license.  Candidates for this role must be able to access technical data without a requirement for an export license. We are unable to sponsor or obtain export licenses for this role.

Cirrus Logic strives to select the best qualified applicant for any opening. Different approaches, ideas and points of view are both valued and respected. Employment decisions are made on the basis of job-related criteria without regard to race, color, religion, sex, national origin, age, protected veteran or disabled status, genetic information, or any other classification protected by applicable law. 

Skills Required

  • BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
  • 7+ years of experience in a package design engineering or related role
  • Demonstrable experience in packaging-related field
  • Experienced Cadence SiP layout user
  • Strong AutoCAD user
  • Knowledge of packaging technologies, materials, package substrate design and assembly rules
  • Understanding of electrical simulation results on a package design
  • Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations
  • Strong written and verbal communication skills

Cirrus Logic Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Cirrus Logic and has not been reviewed or approved by Cirrus Logic.

  • Healthcare Strength Healthcare includes multiple medical, dental and vision options, mental‑health resources, wellness programs, and access to an on‑site clinic in Austin. Feedback suggests these offerings underpin strong total‑rewards sentiment.
  • Parental & Family Support Programs span paid parental leave, fertility/adoption/surrogacy coverage, backup/dependent‑care supports, and a structured flex return. Feedback suggests family‑building depth is a notable strength of the package.
  • Strong & Reliable Incentives Compensation design features semiannual performance bonuses, profit‑sharing, and recognition awards that augment base pay. Feedback suggests these incentives help maintain competitive total compensation in key engineering roles.

Cirrus Logic Insights

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The Company
HQ: Austin, TX
1,604 Employees
Year Founded: 1984

What We Do

Cirrus Logic is a leading supplier of low-power, high-precision mixed-signal processing solutions for mobile and consumer applications. The company has a robust portfolio of sophisticated low-power products, including boosted amplifiers, smart codecs, camera controllers, haptic driver and sensing solutions, power conversion and control Integrated Circuits, and fast-charging Integrated Circuits. These solutions have innovative technology, software and associated algorithms incorporated. With a strong intellectual property portfolio and extensive mixed-signal expertise, Cirrus Logic is well-positioned to drive innovation and growth in the evolving markets of audio and high-performance mixed-signal processing technologies. We are hiring like crazy! Please visit our careers portal at cirrus.jobs to check out our available openings!

Why Work With Us

Engineering drives our company, and innovation isn’t just encouraged – it’s expected! This is a culture where you get to work with some of the largest, most innovative customers and products on the planet on a daily basis and where everyone is a key contributor to the company’s success. There are no Miltons here!

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