Staff Engineer Process Development

Posted 4 Days Ago
Be an Early Applicant
Ipoh, Kinta, Perak, MYS
In-Office
Senior level
Semiconductor • Manufacturing
The Role
Develops and optimizes AOI and CDWJ processes for semiconductor power packaging, including parameter verification, process freezes, FMEA, specifications, engineering builds, supplier collaboration, DFM, design rules, gap analysis, and problem solving. Supports new packaging technology development, transfers processes and knowledge to operations, and trains engineers and personnel.
Summary Generated by Built In
  • Perform AOI and CDWJ Process development activities (Parameters optimization, verification & Freeze) according to project requirements ie timeline, quality and cost
  • Create or Update DFMEA ,PFMEA and process specifications with respect to AOI and CDWJ process
  • Support engineering and qual builds in accordance to project timeline
  • Work with material and equipment suppliers for continuous process improvement
  • Participate in Design Rules, Design of Manufacturing (DFM), Gap Analysis and problem solving during development and pre-production stage
  • Participate and contribute to generation of new ideas or new packaging technology (from AOI and CDWJ)
  • Responsible for technical handshake and knowledge transfer from development to operation
  • Participate in the training of other engineers or personnel within his/her area of expertise as and when required
  • Support Project management, material inventory, EBR loading, documentations.
  • Performs any other duties as assigned by supervisor

Job Requirement

  • At least 5 years in same/related field
  • Degree/Masters preferably of in Mechanical or materials engineering
  • Good Process/equipment knowledge in semiconductor packaging, assembly especially in AOI/CDWJ for Power packaging
  • Statistical Analysis (JMP) & Computer skills, Statistical Stack Up Tolerance Analysis
  • Good communication and presentation skills

Skills Required

  • At least 5 years of experience in the same or a related field
  • Degree or master's degree, preferably in Mechanical Engineering or Materials Engineering
  • Process and equipment knowledge in semiconductor packaging and assembly, especially AOI and CDWJ for power packaging
  • Statistical analysis experience using JMP
  • Computer skills
  • Statistical stack-up tolerance analysis experience
  • Good communication and presentation skills

Cree Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Cree and has not been reviewed or approved by Cree.

  • Fair & Transparent Compensation — Pay is often described as fair or decent in technician and operator roles. Compensation in some project management and security supervision roles is characterized as good.
  • Healthcare Strength — Benefits include medical, dental, and vision coverage with HSA, FSA, and HRA options, plus EAP support. Wellness resources are highlighted alongside core health plans.
  • Parental & Family Support — The package includes six weeks of paid parental leave and adoption assistance. Leave applies to new birth, adoption, and foster placement.

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The Company
HQ: Racine, WI
2,773 Employees
Year Founded: 1987

What We Do

Cree | Wolfspeed is the global leader in silicon carbide technology and production, leading the worldwide transition from silicon to silicon carbide. Our product portfolio provides disruptive technology solutions that support a more efficient, sustainable future including electric vehicles, fast charging, 5G, power supplies, renewable energy and storage, as well as aerospace and defense. Our people are dedicated to driving a significant shift in the technology sector and creating a global semiconductor powerhouse. For additional product and Company information, visit www.cree.com.

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