Staff Engineer-Lead frame & Package Design

Posted 4 Days Ago
Be an Early Applicant
Ipoh, Kinta, Perak, MYS
In-Office
Senior level
Semiconductor • Manufacturing
The Role
Designs and reviews semiconductor packages, platforms, components, sub-assemblies, and package outlines. Maintains design documentation and rules in PDM, supports assembly and test design rules, conducts DFM and feasibility studies, and performs mechanical stack-up tolerance analysis. The role also updates design standards based on supplier, equipment, and customer requirements. Semiconductor assembly and test manufacturing, FEA simulation, AutoCAD, and lead frame design experience are valuable.
Summary Generated by Built In
  • Performs design-generation and reviews for new packages or platforms which includes component , sub-assembly and Package Outline for new platforms and new devices
  • Ensures that the appropriate documents are in place for all new & existing design  changes in PDM
  • Participate in Assembly & Test Design Rules, Design of Manufacturing (DFM) and Feasibility studies which includes mechanical stack-up tolerancing to ensure an design is optimised for cost and manufacturability
  • Maintenance & revision of Design rules to ensure they are up to date taking into account Suppliers, equipment & Customer capabilities and requirements respectively.
  • Knowledge of semiconductor Assembly/Test manufacturing and FEA simulation is an advantage
  • Performs other functions as may be assigned from time to time by superior.

Job Specification

  • Education/Knowledge: University graduate, preferably of an Engineering course with knowledge in mechanical design(2D &3D) Software
  • Skills: Excellent Computer skills
  • Work Experience: At least 5 to 8 years in same/related field, with AutoCAD experience especially in Semiconductor Packaging & Lead frame design

Skills Required

  • University graduate
  • Engineering education or background
  • Knowledge of mechanical design using 2D and 3D software
  • Excellent computer skills
  • At least 5 to 8 years of experience in the same or a related field
  • AutoCAD experience
  • Experience in semiconductor packaging and lead frame design

Cree Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Cree and has not been reviewed or approved by Cree.

  • Fair & Transparent Compensation — Pay is often described as fair or decent in technician and operator roles. Compensation in some project management and security supervision roles is characterized as good.
  • Healthcare Strength — Benefits include medical, dental, and vision coverage with HSA, FSA, and HRA options, plus EAP support. Wellness resources are highlighted alongside core health plans.
  • Parental & Family Support — The package includes six weeks of paid parental leave and adoption assistance. Leave applies to new birth, adoption, and foster placement.

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The Company
HQ: Racine, WI
2,773 Employees
Year Founded: 1987

What We Do

Cree | Wolfspeed is the global leader in silicon carbide technology and production, leading the worldwide transition from silicon to silicon carbide. Our product portfolio provides disruptive technology solutions that support a more efficient, sustainable future including electric vehicles, fast charging, 5G, power supplies, renewable energy and storage, as well as aerospace and defense. Our people are dedicated to driving a significant shift in the technology sector and creating a global semiconductor powerhouse. For additional product and Company information, visit www.cree.com.

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