Sr. Wire Bond Equipment Engineer

Posted 19 Days Ago
Be an Early Applicant
Hiring Remotely in Kaohsiung City, TWN
Remote
Senior level
Automotive • Internet of Things • Mobile • Semiconductor • Industrial
The Role
Lead maintenance, troubleshooting, and continuous improvement for wire bond equipment. Drive qualification, upgrades, automation projects, and collaborate with Process, Production, and Quality to improve yield and uptime. Develop procedures, analyze equipment performance, and train technicians to minimize downtime.
Summary Generated by Built In

Key Responsibilities

  • Maintain and support wire bond equipment to ensure high uptime and reliability.
  • Troubleshoot equipment issues and implement effective corrective actions.
  • Perform preventive maintenance and drive continuous equipment improvements.
  • Support production operations and minimize equipment downtime.
  • Work with Process, Production, and Quality teams to improve yield and product quality.
  • Lead and drive equipment qualification, sustaining , upgrade and automation projects.
  • Analyze equipment performance data and implement productivity improvements.
  • Develop and maintain maintenance procedures, work instructions, and technical documentation.
  • Train and mentor technicians on equipment operation and troubleshooting.

Requirements

  • Bachelor's degree or above in Engineering related field (Mechanical, Electrical are preferred).
  • Minimum 3 years of semiconductor manufacturing experience.
  • Strong troubleshooting and root cause analysis skills.
  • Familiar with SPC, FMEA, 8D, and continuous improvement methodologies.
  • Good communication and teamwork skills.
  • Able to support a fast-paced manufacturing environment.

Preferred Qualifications

  • TOEIC >600 or other English comprehensive certification
  • Experience with wire bonder, eg K&S Rapid; ASM AERO...etc
  • Knowledge of automation, SECS/GEM, and equipment data analysis.
  • Six Sigma Green Belt or equivalent certification.


More information about NXP in Greater China...

#LI-2370

Skills Required

  • Bachelor's degree in Engineering (Mechanical, Electrical preferred)
  • Minimum 3 years of semiconductor manufacturing experience
  • Strong troubleshooting and root cause analysis skills
  • Familiarity with SPC, FMEA, 8D, and continuous improvement methodologies
  • Good communication and teamwork skills
  • Able to support a fast-paced manufacturing environment
  • TOEIC >600 or other English comprehensive certification
  • Experience with wire bonder (e.g., K&S Rapid, ASM AERO)
  • Knowledge of automation, SECS/GEM, and equipment data analysis
  • Six Sigma Green Belt or equivalent certification
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The Company
HQ: Eindhoven
21,993 Employees
Year Founded: 2006

What We Do

NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer and more sustainable world through innovation. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 34,500 employees in more than 30 countries and posted revenue of $13.21 billion in 2022. Find out more at www.nxp.com. Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA

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