Sr. Test Innovation Process Engineer

Reposted Yesterday
Be an Early Applicant
Hiring Remotely in Kaohsiung City
Remote
Mid level
Automotive • Internet of Things • Mobile • Semiconductor • Industrial
The Role
Plan and execute projects for qualifying new test technologies, analyze technical issues, develop processes, and participate in product testing and risk assessments.
Summary Generated by Built In
Job Responsibilities:
  • Plan and execute projects to evaluate and qualify new test equipment, technologies, and processes to support the fastest path to revenue. The focus is to improve cost, yield, quality, and productivity of test for NXP’s Products prior to NPI (New Product Introduction), during NPI, and during production.
  • Analyze and resolve technical issues and challenges in Probe and Final Test – working closely with global product/test engineering, test innovation, global hardware engineering, wafer fab process engineering, package innovation, AT (Assembly & Test) engineering, and manufacturing teams.
  • Report experimental results to appropriate User Groups and Project Review Boards across global time zones.
  • Run Experiments on Engineering and Production Test Equipment (Probers/Handlers/Testers)
  • Develop and documents new processes for Wafer Test and Final Test Hardware and Equipment
  • Participates as SME in Test Risk Assessment process to identify, prevent and mitigate risks, securing the introduction of new products.
  • Participate in supplier selection and test technology selection for New Products understanding test sensitivities across Wafer Test and Final Test platforms.
Requirements:
  • Master's/Bachelor's degree in Electronics or Electrical/Mechanical Engineering with 3-5 years of relevant working experience.
  • Knowledge of NXPs BCAM process preferred.
  • Proven skills in failure analysis, test software programming and/or test process development are highly desirable.
  • Proven skills in data analysis, statistical analysis, and design of experiments for methodical problem solving and best test/engineering solution selection.
  • Knowledge of TEL/Accretech Wafer probers
  • Knowledge of Cohu/Epson Final Test Handlers
  • Knowledge of ATE Testers is a plus, especially for Advantest ExaScale and Teradyne UltraFlexplus Test systems.
  • Knowledge of Semiconductor Manufacturing is an added advantage.
  • Knowledge of mixed signal and/or digital test techniques for microprocessors, microcontrollers, memories and DSP is an advantage.
  • Knowledge of UNIX, Perl, C/C++ is an added advantage.
  • Working knowledge of Lean Manufacturing and Six Sigma tools.
  • Fast learner to meet skills requirement for new and advancing Semiconductor product testing.
  • Self-motivated and positive attitude.
  • Strong in problem solving, continuous improvement.
  • Excellent interpersonal communication skills with all levels and able to work well with cross functional teams in the local ATKH engineering.
  • Fluent in English communication, both written and verbal.


More information about NXP in Greater China...

#LI-2370

Top Skills

Advantest Exascale
C/C++
Cohu/Epson Final Test Handlers
Nxps Bcam Process
Perl
Tel/Accretech Wafer Probers
Teradyne Ultraflex Test Systems
Unix
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The Company
HQ: Eindhoven
21,993 Employees
Year Founded: 2006

What We Do

NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer and more sustainable world through innovation. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 34,500 employees in more than 30 countries and posted revenue of $13.21 billion in 2022. Find out more at www.nxp.com.

Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA

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