Sr Staff Package Design Engineer

Posted Yesterday
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Tempe, AZ, USA
Hybrid
Senior level
3D Printing
The Role
Lead development and qualification of hermetic, ceramic, metal, radiation-tolerant, and Class P plastic semiconductor packages for high-reliability space, aerospace, and power applications. Define requirements, processes, tooling, and qualification plans; collaborate with product, reliability, OSAT partners, and manufacturing to execute DOE, optimize assembly, create package drawings in AutoCAD, and maintain roadmap and supplier qualification.
Summary Generated by Built In
Company Description

Renesas is a global semiconductor company delivering embedded solutions across microcontrollers, analog, power, and SoC products. Our technologies support critical applications across automotive, industrial, infrastructure, and IoT markets, helping enable smarter, safer, and more efficient systems.

Job Description

Renesas is seeking a Sr. Staff Package Design Engineer to support advanced package technology development for commercial space, aerospace, and high-reliability power applications. This role will focus on hermetic, ceramic, metal, radiation-tolerant, and Class P plastic packaging solutions, working closely with product design, reliability, OSAT partners, in-house assembly teams, and key package suppliers to define, develop, qualify, and optimize package technologies for demanding high-reliability environments.

Responsibilities

  • Develop hermetic, ceramic, metal, radiation-tolerant, and Class P plastic package technologies and interconnect methods for commercial space, aerospace, and high-reliability power applications.
  • Define package technology requirements, tooling needs, process flows, and qualification plans for new and existing package platforms.
  • Benchmark, select, and qualify materials, assembly processes, and subcontractors, including OSAT partners and Renesas’ in-house Palm Bay assembly site.
  • Partner with Renesas product design teams to develop detailed package drawings for hermetic and plastic packages using AutoCAD.
  • Work with OSAT partners and internal manufacturing teams to run DOE activities, optimize assembly processes, and establish process specifications.
  • Collaborate with product engineering, program management, and reliability teams to qualify new packages and processes within required project schedules.
  • Maintain technical expertise on advances in hermetic, ceramic, metal, radiation-tolerant, and Class P plastic packaging technologies.
  • Participate in packaging roadmap development, with a focus on execution, manufacturability, reliability, and long-term package strategy.

Qualifications

  • 5–12 years of relevant experience in semiconductor package development, with emphasis on hermetic, ceramic, metal, radiation-tolerant, or Class P plastic packaging.
  • Experience with semiconductor IC assembly processes, materials, package technologies, and package qualification.
  • Familiarity with high-reliability, aerospace, commercial space, or defense-related semiconductor packaging requirements.
  • Experience working with external package suppliers, OSAT partners, or internal assembly/manufacturing sites.
  • Knowledge of AutoCAD and Microsoft Office tools, including Excel, PowerPoint, and Word.
  • Strong communication, analytical, presentation, and cross-functional collaboration skills.
  • Familiarity with MIL-STD-883, MIL-PRF-38535, and MIL-STD-750 standards.

Education

  • Bachelor’s, Master’s, or Doctorate degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a related technical field.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
 
With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’     
 
At Renesas, you can: 

  • Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.  
  • Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. 
  • Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.    

Are you ready to own your success and make your mark?  

Join Renesas. Shape Your Future with Us.  

Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Skills Required

  • 5-12 years relevant experience in semiconductor package development with emphasis on hermetic, ceramic, metal, radiation-tolerant, or Class P plastic packaging
  • Experience with semiconductor IC assembly processes, materials, package technologies, and package qualification
  • Familiarity with high-reliability, aerospace, commercial space, or defense-related semiconductor packaging requirements
  • Experience working with external package suppliers, OSAT partners, or internal assembly/manufacturing sites
  • Proficiency with AutoCAD
  • Proficiency with Microsoft Office tools including Excel, PowerPoint, and Word
  • Strong communication, analytical, presentation, and cross-functional collaboration skills
  • Familiarity with MIL-STD-883, MIL-PRF-38535, and MIL-STD-750 standards
  • Bachelor's, Master's, or Doctorate degree in Physics, Chemistry, Mechanical, Electrical, Materials Engineering, or related technical field

Renesas Electronics Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.

  • Fair & Transparent Compensation Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
  • Healthcare Strength Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
  • Leave & Time Off Breadth Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.

Renesas Electronics Insights

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The Company
HQ: Toyosu, Tokyo
10,040 Employees

What We Do

We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.

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