- Be the product package solution project leader from Package Innovation R&D team to develop the package solution for Mobile, Secure Communications, Wireless Connectivity, Power, IoT and Radar applications.
- This position is responsible for leading the packaging projects for New Product Introduction and New Technology Introduction.
- Executing the projects to ensure that all the packaging deliverables are met to support a New product introduction and time to market.
- You will coordinate activities across multiple organizations including marketing, IC design, applications, test, assembly engineering, internal and external manufacturing and you will be working with teams across multiple countries.
- Effectively coordinate and lead complex technical discussion across multiple organizations and stakeholders in NXP internal and external.
- Translating the product requirements for New product introduction in terms of package specific spec., reliability, cost.
Qualifications :
- Master’s or bachelor’s degree in Material Science, Electrical Engineering.
- Proactive working attitude and capable to handle new challenge.
- Analytically strong, drives for results, able to deal with ambiguities.
- Ambitious, energetic, result-oriented entrepreneur with a strong drive for results.
- People person and team player, very strong interpersonal skills
- Related field along with at least 10 years of experience in semiconductor IC packaging.
- Proficient risk assessment, risk mitigation and 8D skill.
- Knowledge of related package platforms such as leadframe based, laminate substrate, flip chip, and Wafer Level Chip Scale Packaging is also expected.
- Project management experience is required.
- Fluent verbal and writing in both English and Japanese skills are required for communication with US/European teams and Japanese Customers/Suppliers.
Preferred Qualifications :
- Understanding of foundry process, assembly process, and failure analysis.
- PMP and Six Sigma certification is preferred.
- Good coomunication in both English and Japanese languages.
More information about NXP in Japan...
Skills Required
- Master's or Bachelor's degree in Material Science or Electrical Engineering
- At least 10 years of experience in semiconductor IC packaging
- Project management experience
- Proficient in risk assessment, risk mitigation and 8D methodology
- Knowledge of package platforms: leadframe based, laminate substrate, flip chip, WL-CSP
- Fluent verbal and written English and Japanese
- Understanding of foundry process, assembly process, and failure analysis
- PMP and Six Sigma certification
- Strong interpersonal, analytical, and proactive work attitude
What We Do
NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer and more sustainable world through innovation. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 34,500 employees in more than 30 countries and posted revenue of $13.21 billion in 2022. Find out more at www.nxp.com. Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA
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