Sr. Product Engineer

Posted Yesterday
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Santa Clara, CA, USA
In-Office
111K-140K Annually
Senior level
Semiconductor • Manufacturing
The Role
Owns product engineering from semiconductor tapeout through mass production. Responsibilities include product definition, DFM input, product introduction and ramp-up, yield analysis and corrective actions, characterization, datasheet finalization, and development and release of wafer probe and final test programs. Supports existing products, resolves technical issues with R&D and manufacturing teams, and drives yield improvements for image sensor and ASIC devices.
Summary Generated by Built In
Primary responsibility is to bring a new product from tapeout to mass production. Candidate designs a characterization/testing plan and works with R&D teams and manufacturing engineers on technical issues, resolving these issues to meet performance requirements on product requirement documents. For existing products, the senior product engineer will maintain and sustain technical support and actively participate in yield improvements.
 
Description 
  • Owner of assigned products
  • Participate in product definition and provide DFM inputs.
  • Lead product introduction and ramp-up for image sensors and ASIC devices.
  • Analyze yield and drive corrective actions for yield improvements.
  • Drive characterization to finalize the product datasheet.
  • Co-work with testing engineers to develop, verify and release testing program at CP or FT.
 
Preferred:   
  • 4-6 yrs of Product Engineering experience in image sensor or memory (flash, SRAM, DRAM) or ASIC products.
  • Familiarity with silicon process will be plus.
  • Good communication and organizational skills
  • Strong analytical and problem solving skills.
  • Master's Degree in EE or Physics, or a related field.
  • Mandarin speaking proficiency (both spoken and written), strongly preferred due to daily interactions with our China-based team. This skill is crucial for effective communication, understanding project requirements, and fostering strong relationships within our international team.
 
Annual base salary for this role in California, US is expected to be between $110,600 - $140,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.  
 
EOE/Minorities/Females/Vet/Disability  
 
 

Skills Required

  • 4–6 years of product engineering experience with image sensor, memory, or ASIC products
  • Familiarity with silicon processes
  • Good communication and organizational skills
  • Strong analytical and problem-solving skills
  • Master’s degree in electrical engineering, physics, or a related field
  • Mandarin speaking proficiency, both spoken and written
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The Company
HQ: Santa Clara, California
1,448 Employees
Year Founded: 1985

What We Do

Founded in 1995, OMNIVISION has been at the leading-edge of technology, developing and delivering advanced digital imaging, analog, and touch & display solutions for multiple applications across several industries. With more than 3,000 employees worldwide and over 13 billion products shipped, OMNIVISION is a well-known global fabless semiconductor company. Our products can be found everywhere in people’s lives including mobile phones, security & surveillance, automotive, computing, medical, and emerging applications. Across these segments, OMNIVISION’S award-winning technology enables a smoother human/machine interface in many of today’s commercial devices. In this way, OMNIVISION delivers solutions that put its customers at the leading edge of technology. Whether it be developing the first mobile handset camera accessory in 2002, introducing the world’s smallest NTS camera in 2006 or launching PureCel CMOS image sensors in 2013, our dedication to providing reliable, innovative imaging and sensing solutions continue to be the primary aim. The company has recorded numerous industry firsts in its relentless quest for technology breakthroughs that deliver #InfiniteIngenuity: • Guinness World Record for the World's Smallest Commercially Available Image Sensor (OV6948) in 2019. In 2021, it beat its own record with the new OH0TA OVMed® • First to commercialize backside illumination technology in 2007 (OmniBSI™) • Industry's 1st to deploy the most mature LED Flicker Mitigation (LFM) solution in mass production for multiple automotive applications • Automotive industry leader with HALE, our HDR & LFM Engine combination algorithm • Developer of Nyxel® near-infrared technology with by far the best quantum efficiency in CMOS near-infrared imagine • Creator of CameraCubeChip™, the industry’s 1st wafer-level camera modules • First and only global shutter image sensors with cybersecurity, for ADAS and autonomous vehicles • First to introduce RBG-Ir technology to medical

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