Sr. Product Engineer

Posted Yesterday
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Santa Clara, CA, USA
In-Office
132K-135K Annually
Senior level
Semiconductor • Manufacturing
The Role
Designs characterization and testing plans for CMOS imaging sensors and ASIC products, collaborating with R&D, manufacturing, foundry, testing, and pixel design teams. Improves wafer yield, silicon processes, color, packaging, layouts, and product performance through data analysis and corrective actions. Supports product definition, datasheet finalization, tape-out process flows, fab ramp-up, vendor optimization, and production testing. Uses Python to improve data-analysis efficiency.
Summary Generated by Built In
Design a characterization/testing plan and work with R&D teams and manufacturing engineers to resolve various technical issues to meet performance requirements; participate in product definition and provide DFM inputs; work in close collaboration with silicon foundry, imager characterization and pixel design; interact with foundry fab in improving all silicon process, color, and package issues; improve product yield and performance by process optimization and layout design update; analyze yield and drive corrective actions for yield improvements; drive characterization to finalize the product datasheet; work with pixel design group to design the most sophisticated and optimized pixel layout; work with characterization team to analyze and debug pixel device circuit and various image related issues; ramp up for image sensors and ASIC devices; coordinate with company's fab to drive semiconductor processing tool vendors to optimize processes, including raw material vendor, IMP tool vendor and photo resist vendor etc.; set up new tape out product process flows, inline handbooks, JDV check etc.; work with testing engineers to develop, verify and release testing program at CP or FT.Program coding, such as python, to improve work efficiency in data analysis. 
 
Requirements:
 
Master’s degree or foreign equivalent degree in Materials Science & Engineering, Physics, or related fields.
 
Require two years of experience in process integration.
 
Require experience/skills of:
 
  • Analyze the correlation among Yield/Defect/Inline/Reliability and reduce lost.
  • Assess CMOS Imaging Process to maximize the production capacity in Fab.
  • Construct multiple work systems with IT to reduce workload.
  • Release CMOS Imaging Process proposals to deduct the expense of material and improve the yield of wafer edge.
  • Conduct a course to enhance colleagues' vigilance against product defect disasters.
  • Implement customers’ IP design into new node and perform trial run in Fab.
  • Forecast yield precisely and estimate the target in next season.
  • Plan the process/testing priority of the product to trace issues during the mass production.
  • Ensure the quality of the wafers by the strict management from wafer-start to fab-out.
 
Annual base salary for this role in California, US is expected to be between $131,706 - $135,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.

Skills Required

  • Master's degree or foreign equivalent in Materials Science and Engineering, Physics, or a related field
  • Two years of experience in process integration
  • Experience analyzing correlations among yield, defects, inline data, and reliability to reduce losses
  • Experience assessing CMOS imaging processes to maximize fab production capacity
  • Experience constructing IT work systems to reduce workload
  • Experience developing CMOS imaging process proposals to reduce material expenses and improve wafer-edge yield
  • Experience conducting training to improve awareness of product defect risks
  • Experience implementing customer IP designs into new process nodes and performing fab trial runs
  • Experience forecasting yield and estimating future production targets
  • Experience planning product process and testing priorities to trace mass-production issues
  • Experience managing wafer production from wafer start through fab out to ensure quality
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The Company
HQ: Santa Clara, California
1,448 Employees
Year Founded: 1985

What We Do

Founded in 1995, OMNIVISION has been at the leading-edge of technology, developing and delivering advanced digital imaging, analog, and touch & display solutions for multiple applications across several industries. With more than 3,000 employees worldwide and over 13 billion products shipped, OMNIVISION is a well-known global fabless semiconductor company. Our products can be found everywhere in people’s lives including mobile phones, security & surveillance, automotive, computing, medical, and emerging applications. Across these segments, OMNIVISION’S award-winning technology enables a smoother human/machine interface in many of today’s commercial devices. In this way, OMNIVISION delivers solutions that put its customers at the leading edge of technology. Whether it be developing the first mobile handset camera accessory in 2002, introducing the world’s smallest NTS camera in 2006 or launching PureCel CMOS image sensors in 2013, our dedication to providing reliable, innovative imaging and sensing solutions continue to be the primary aim. The company has recorded numerous industry firsts in its relentless quest for technology breakthroughs that deliver #InfiniteIngenuity: • Guinness World Record for the World's Smallest Commercially Available Image Sensor (OV6948) in 2019. In 2021, it beat its own record with the new OH0TA OVMed® • First to commercialize backside illumination technology in 2007 (OmniBSI™) • Industry's 1st to deploy the most mature LED Flicker Mitigation (LFM) solution in mass production for multiple automotive applications • Automotive industry leader with HALE, our HDR & LFM Engine combination algorithm • Developer of Nyxel® near-infrared technology with by far the best quantum efficiency in CMOS near-infrared imagine • Creator of CameraCubeChip™, the industry’s 1st wafer-level camera modules • First and only global shutter image sensors with cybersecurity, for ADAS and autonomous vehicles • First to introduce RBG-Ir technology to medical

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