Responsibilities:
- Develops process modules to realize new CIS technologies
- Collaborates with foundry partners to define and improve the CIS silicon, color and package process for each CIS technology
- Provides support to production and design teams to improve yield and overall sensor performance
- Analyzes and interprets bench and wafer level data
- Designs and manages silicon split lots with respect to project goals and schedules
Qualifications:
- 2-10 yrs experience in Si based device technology (CMOS, CIS, etc), including developing advanced processes; CIS process experience is a plus (but not a requirement)
- Device physics background is desired.
- PhD or MS in Electrical Engineering or Physics.
EOE/Minorities/Females/Vet/Disability
Skills Required
- 2-10 years of experience in silicon-based device technology, including CMOS, CIS, or advanced process development
- Background in device physics
- PhD or MS degree in Electrical Engineering or Physics
- CIS process experience
What We Do
Founded in 1995, OMNIVISION has been at the leading-edge of technology, developing and delivering advanced digital imaging, analog, and touch & display solutions for multiple applications across several industries. With more than 3,000 employees worldwide and over 13 billion products shipped, OMNIVISION is a well-known global fabless semiconductor company. Our products can be found everywhere in people’s lives including mobile phones, security & surveillance, automotive, computing, medical, and emerging applications. Across these segments, OMNIVISION’S award-winning technology enables a smoother human/machine interface in many of today’s commercial devices. In this way, OMNIVISION delivers solutions that put its customers at the leading edge of technology. Whether it be developing the first mobile handset camera accessory in 2002, introducing the world’s smallest NTS camera in 2006 or launching PureCel CMOS image sensors in 2013, our dedication to providing reliable, innovative imaging and sensing solutions continue to be the primary aim. The company has recorded numerous industry firsts in its relentless quest for technology breakthroughs that deliver #InfiniteIngenuity: • Guinness World Record for the World's Smallest Commercially Available Image Sensor (OV6948) in 2019. In 2021, it beat its own record with the new OH0TA OVMed® • First to commercialize backside illumination technology in 2007 (OmniBSI™) • Industry's 1st to deploy the most mature LED Flicker Mitigation (LFM) solution in mass production for multiple automotive applications • Automotive industry leader with HALE, our HDR & LFM Engine combination algorithm • Developer of Nyxel® near-infrared technology with by far the best quantum efficiency in CMOS near-infrared imagine • Creator of CameraCubeChip™, the industry’s 1st wafer-level camera modules • First and only global shutter image sensors with cybersecurity, for ADAS and autonomous vehicles • First to introduce RBG-Ir technology to medical
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