Sr. Principal Foundry Engineer – Logic/RF Device Expert

Description:    The APAC Central Competence Team partners with external foundries to ensure robust chip supply and technology enablement for NXP’s business lines. This role focuses on driving advanced node technology ramp-up and transfer, with a strong emphasis logic/RF devices. The primary responsibility of this role is to lead and support new technology introduction (NTI) and process transfers involving logic/RF technologies, ensuring manufacturability, yield, and performance targets are met.

The key areas of responsibility of the jobholder are:
-    Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes.
-    Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior.
-    Interface with internal and external stakeholders on critical development and transfer projects.
-    Lead and steer projects to meet timelines and business objectives.
-    Make key decisions on process integration, balancing technical, logistical, and strategic factors.
-    Support NTI process transfers within foundries and NXP joint ventures

    
Requirements / preferences:    

-    Bachelor’s or Master’s degree in Electrical Engineering, Physics, or related field.
-    Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices.
-    Proven hands-on experience with HKMG and FinFET technologies in production or development environments.
-    Deep understanding of semiconductor device physics, especially HKMG and FinFET.
-    Strong analytical skills in yield enhancement and electrical data analysis.
-    Fluent in English and Mandarin.
-    Demonstrated leadership in development, transfer, or ramp-up projects.
-    Excellent communication and influencing skills.
-    Proactive, pragmatic, and results-driven mindset.
-    Experience working with foundries and leveraging external manufacturing capabilities .
 

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