Sr. Manager - Wet Process/Plating/CMP Development

Change the world. Love your job.
We’re at the forefront of an exciting era of semiconductor innovation at Texas Instruments’ LFAB in Lehi, Utah, home to our state-of-the-art 300mm manufacturing facility now ramping our most advanced 28nm analog and embedded process technology in the heart of the Silicon Slopes. As part of our Advanced Technology Development (ATD) organization, you won’t just support production, you’ll create the technology that makes it possible. From developing the Resolution Enhancement Techniques and OPC models that enable 28nm lithographic patterning, to engineering the precision wet process chemistries that define device performance at atomic scale, ATD engineers are solving the hardest problems in analog semiconductor development. At full production, our fabs will manufacture tens of millions of analog and embedded processing chips every day which are built on the process technologies you help create and qualify. We’re committed to responsible, sustainable manufacturing and making a meaningful impact on the local community through job creation and substantial investments in K–12 STEM education. In this role, you’ll work at the intersection of fundamental research and high-volume manufacturing, turning process innovations into production-ready technologies that power electronics everywhere.

Texas Instruments is seeking a CMP/Wet/Plating Process Development Sr. Manager. In this role, you will oversee the activities related to the technical support and process development engineering functions of a manufacturing area. You may also plan and implement the development of new and scale-up process formulas. Additional job functions include establishing operating equipment specifications and acting as a liaison with product design and development to ensure processes and designs are compatible. Leading efforts to achieve cost effectiveness and improved product quality is key. As a CMP/Wet/Plating Process Development Engineering Sr. Manager, you may select, develop, and evaluate personnel to ensure the efficient operation of the function.

Minimum requirements:

• Master’s in Chemical Engineering, Materials Science, Physics, or related field
• 10+ years of semiconductor process development experience, with strong expertise in wet processing, plating, and/or CMP
• Proven experience in advanced node development (28nm, 22nm, or below)
• Deep understanding of one or more of the following:
  • CMP mechanisms and consumables
  • Wet etch and cleaning chemistries
  • Surface preparation and contamination control
  • Process integration and device interactions
• Strong knowledge of SPC, DOE, and data analysis techniques

Preferred qualifications:

• PhD in Chemical Engineering, Materials Science, Physics, or related field
• Experience in embedded, analog/mixed-signal or power semiconductor technologies
• Familiarity with TI product applications such as automotive, industrial, and embedded systems
• Background in R&D environments with successful technology transfer to manufacturing
• Experience with automation, scripting, or data science tools for process optimization
• Demonstrated ability to influence senior leadership and drive cross-functional alignment