The Role
Lead technology transfer and manufacturing readiness for SiC/GaN products, drive yield and process-control improvements using statistical methods, support device reliability and failure analysis, manage foundry relationships, and build and mentor a device engineering team to ensure robust ramp into high-volume production.
Summary Generated by Built In
Key Responsibilities and DutiesTechnology Transfer & Manufacturing Readiness
- Lead execution of technology transfers for SiC and GaN products from development into qualified manufacturing flows.
- Support manufacturing readiness reviews, qualification activities, and process-change assessments for new products and technology platforms.
- Drive Safe Launch execution and manufacturing ramp activities to ensure robust transition into volume production.
- Collaborate with global engineering teams to ensure consistent deployment of new technologies across foundry partners.
- Monitor product and process performance throughout the manufacturing lifecycle using statistical and electrical data.
- Drive yield optimization initiatives through DOE, process characterization, root-cause investigations, and corrective-action closure.
- Define and implement process control plans, SPC monitoring, Cpk/Ppk tracking, and manufacturing health indicators.
- Identify and resolve yield, reliability, and device performance issues in collaboration with foundry and cross-functional teams.
- Analyze electrical, process, reliability, and parametric data to improve product performance, manufacturability, and process robustness.
- Support qualification, reliability assessments, and failure-analysis investigations for SiC and GaN technologies.
- Partner with Product Engineering and Test Engineering on screening strategies, guard bands, yield limits, and excursion management.
- Evaluate foundry PCNs, process improvements, and technology changes to determine product impact and qualification requirements.
- Serve as a key technical interface between Navitas and external foundry partners.
- Participate in regular technical reviews with foundries covering process health, yield trends, reliability performance, risk items, and corrective actions.
- Drive closure of process excursions, manufacturing risks, and continuous improvement initiatives.
- Support audits, process assessments, control-plan reviews, and manufacturing risk mitigation activities.
- Build, mentor, and develop a high-performing device engineering team in the Pune Engineering Center.
- Provide technical leadership, coaching, and career development for engineers.
- Foster a culture of accountability, collaboration, data-driven decision making, innovation, and operational excellence.
- Coordinate priorities and execution across global engineering, operations, quality, test, reliability, and product teams.
- M.S. or Ph.D. in Electrical Engineering, Semiconductor Engineering, Materials Science, Physics, or a related technical field.
- 8-10 years of semiconductor device, process, product, or foundry engineering experience.
- Strong understanding of power semiconductor device physics and manufacturing processes.
- Experience with SiC and/or GaN technologies preferred.
- Deep working knowledge of SPC, DOE, Cpk/Ppk analysis, FMEA, control plans, root-cause analysis, and yield analytics.
- Experience analyzing electrical parametric, process, yield, and reliability data to make data-driven decisions.
- Direct experience working with wafer foundries or external manufacturing partners.
- Proven experience leading engineering projects and mentoring technical teams.
- Excellent communication skills with the ability to collaborate effectively across global, cross-functional organizations.
- Experience supporting technology transfer and manufacturing ramp for power semiconductor products.
- TCAD simulation, device characterization, and power device modeling experience.
- Understanding of reliability qualification standards, failure-analysis methodologies, and process excursion management.
- Experience in a high-volume semiconductor manufacturing environment.
- Experience leading or coordinating geographically distributed engineering teams.
Skills Required
- M.S. or Ph.D. in Electrical Engineering, Semiconductor Engineering, Materials Science, Physics, or related technical field
- 8-10 years of semiconductor device, process, product, or foundry engineering experience
- Strong understanding of power semiconductor device physics and manufacturing processes
- Experience with SiC and/or GaN technologies
- Deep working knowledge of SPC, DOE, Cpk/Ppk analysis, FMEA, control plans, root-cause analysis, and yield analytics
- Experience analyzing electrical parametric, process, yield, and reliability data to make data-driven decisions
- Direct experience working with wafer foundries or external manufacturing partners
- Proven experience leading engineering projects and mentoring technical teams
- Excellent communication skills and ability to collaborate across global, cross-functional organizations
- Experience supporting technology transfer and manufacturing ramp for power semiconductor products
- TCAD simulation, device characterization, and power device modeling experience
- Understanding of reliability qualification standards, failure-analysis methodologies, and process excursion management
- Experience in a high-volume semiconductor manufacturing environment
- Experience leading or coordinating geographically distributed engineering teams
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