SPE Signal Integrity

Posted 7 Days Ago
Be an Early Applicant
3 Locations
Hybrid
126K-234K Annually
Expert/Leader
Big Data • Internet of Things • Software
The Role
Leads signal and power integrity methodology, package design, modeling, simulations, and analysis for high-speed DDR memory products. Defines packaging, PCB routing, decoupling, channel, jitter, and system requirements; guides design teams using simulation and silicon correlation; collaborates with customers; and supports laboratory debug and bring-up. The role requires extensive DDR4/DDR5 or SERDES experience, electromagnetic and transmission-line expertise, EDA tool proficiency, and lab measurement experience.
Summary Generated by Built In
Overview

Rambus, a premier chip and silicon IP provider, is seeking to hire an exceptional Sr. Principal Engineer with signal integrity and package design experience to join our Memory Interface Chips BU’s engineering team in John's Creek, Georgia. Candidates will be joining some of the brightest inventors and engineers in the world to develop products that make data faster and safer. 

As an SPE Signal Integrity Engineer, you will be reporting to the Senior Director of Engineering and is a Full Time position. In this highly visible role, you will work within our SI/PI team to work on modeling, analysis, and simulations of signal integrity (SI) and power integrity (PI) in the very challenging DDR field with speed up to 16000+ MT/s. 

Rambus offers a flexible work environment, embracing a hybrid approach for most office-based roles. Employees are encouraged to spend an average of at least three days per week onsite, allowing for two days of remote work.  

Responsibilities
  • Create SI/PI methodologies and work with the Design and SI teams to do SI/PI study and package design for the latest DDR product portfolio 
  • Work with our design team and validation team to define specifications and system design requirements such as packaging and PCB routings, IC-PKG-BRD decoupling requirements, channel simulations and jitter sensitivity analysis 
  • Provide guideline to design team based on SI/PI study and simulation and silicon correlation so that our products will have superior SI performance, i.e. best RMT scores 
  • Work with our customers to do collaboration to find the optimum SI/PI solution 
  • Help the team during debug and bring up in lab if needed 
Qualifications
  • Solid background in SI/PI and package design to provide technical leadership to the team 
  • Strong interpersonal skill to keep the team motivated and focused 
  • MS or PhD in Electrical Engineering with 10+ years of industry experience in which at least a few years with exposure to DDR4/5 
  • Prior experience in simulating high speed memory (DDR4, DDR5) and/or SERDES interfaces is required 
  • Solid theoretical background and understanding in EM and transmission line theory is a must 
  • Strong background and solid understanding of equalization techniques such as FIR/FFE/DFE/CTLE are required 
  • Must understand package and PCB design, be able to edit APD/Allegro layout files. Know SI/PI driven BGA assignment methodology and be able to simulate for the trade-offs in the context of a system 
  • Extensive experience in correlating simulation results with lab measurements using scopes, TDRs, VNAs etc. 
  • Strong understanding of the server system, from CPUs to DRAMs on DIMM modules, is highly desirable 
  • Know the mechanisms of crosstalk and jitter in source-synchronous interfaces and be able to include the effect of such losses into low BER simulations 
  • Proficient with simulations using Spice and ADS 
  • Experience with commercial EDA tools such as ADS, HFSS, Q3D/PowerSI 
  • Familiarity with RedHawk/Totem or XcitePI and Virtuoso is a strong plus 
  • Lab characterization experience of passive components, link margin, or noise using real time/sampling scopes and VNA/TDR is a big plus 
  • Basic knowledge of circuits used in high-speed link design is preferred. 
  • Excellent writing and presentation skills are essential as well as good communication skills to work with customers and cross-functional teams. 
  • Must be an innovative, self-motivated individual, be able to manage and drive his projects, and must be a team player 

About Rambus 

Rambus is a global company that makes industry-leading memory interface chips and Silicon IP to advance data center connectivity and solve the bottleneck between memory and processing. With over 30 years of semiconductor experience, we are a leading provider of high-performance products and innovations that maximize the bandwidth, capacity and security for AI and other data-intensive workloads. Our world-class team is the foundation of our company, and our innovative spirit drives us to develop the cutting-edge products and technologies essential for tomorrow’s systems.  

Rambus offers a competitive compensation package including base salary, bonus, equity, matching 401(k), employee stock purchase plan, comprehensive medical and dental benefits, time-off program, and gym membership.  


The US salary range for this full-time position is $126,100 to $234,100. Our salary ranges are determined by role, level and location. The successful candidate’s starting pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. 


At Rambus, we are committed to fostering a workplace where every individual is respected, supported, and empowered to succeed. We value a range of perspectives and experiences that contribute to innovation and collaboration. Our goal is to ensure that all team members have equitable access to opportunities, resources, and a sense of belonging. We believe that a culture of fairness and inclusion helps us all do our best work. 

 Rambus is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender identity, gender expression, age, status as a protected veteran, status as an individual with a disability, genetic information, or other applicable legally protected characteristics.  

  

Rambus is committed to providing reasonable accommodations for qualified individuals with disabilities and disabled veterans during our job application procedures. If you require assistance or an accommodation due to a disability, please feel free to inform us in your application. 


Rambus does not accept unsolicited resumes from headhunters, recruitment agencies or fee-based recruitment services. 


For more information about Rambus, visit rambus.com. For additional information on life at Rambus and our current openings, check out rambus.com/careers/. 


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Skills Required

  • MS or PhD in Electrical Engineering
  • 10+ years of industry experience
  • Several years of exposure to DDR4 and DDR5
  • Prior experience simulating high-speed DDR4, DDR5, and/or SERDES interfaces
  • Solid signal integrity, power integrity, and package design background
  • Strong theoretical understanding of electromagnetics and transmission-line theory
  • Strong understanding of FIR, FFE, DFE, and CTLE equalization techniques
  • Understanding of package and PCB design, including editing APD or Allegro layout files
  • Experience with SI/PI-driven BGA assignment methodology and system-level trade-off simulation
  • Extensive experience correlating simulation results with laboratory measurements using oscilloscopes, TDRs, or VNAs
  • Proficiency with SPICE and ADS simulations
  • Experience with commercial EDA tools such as ADS, HFSS, Q3D, or PowerSI
  • Strong interpersonal, communication, writing, and presentation skills
  • Ability to manage and drive projects independently while working as a team player
  • Understanding of server systems, CPUs, DRAMs, and DIMM modules
  • Familiarity with RedHawk, Totem, XcitePI, or Virtuoso
  • Laboratory characterization experience with passive components, link margin, or noise using real-time or sampling oscilloscopes and VNA/TDR
  • Basic knowledge of circuits used in high-speed link design
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The Company
HQ: San Jose, CA
989 Employees

What We Do

Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security, and emerging technologies to positively impact the modern world. We collaborate with the industry, partnering with leading chip and system designers, foundries, and service providers. Integrated into tens of billions of devices and systems, our products and technologies power and secure diverse applications, including Big Data, Internet of Things (IoT) security and much more!

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