At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
We are actively seeking a Software Engineer (Firmware) Lead, based in Hyderabad OR Bangalore
Responsibilities:
Work to develop, test and maintain embedded firmware for silicon products.
Ensuring the robustness of code by implementing and running a software test suite
Migration, consolidation and development of existing silicon debug software
Software design and support for our silicon design infrastructure
Essential Experience:
Strong experience in designing, coding and debugging real-time applications in C and/or C++ in a embedded environment
Experience in using or implementing Real-Time scheduler or RTOS
Knowledge of 32-bit processor architecture
Interfacing to hardware and peripherals: SPI, I2C/SMBus, JTAG
Debugging at application and hardware level
Appreciation of Software validation and verification techniques
Ability to develop under different platforms (Linux, Windows)
Use of modern SW development workflows (CI/gitlab/makefile/CMake etc.)
Independent, self starter who can help drive the firmware development forward.
Useful Experience:
Development in a modern high-level scripting language (e.g. Python, Lua).
Experience interfacing to flash memory, including in-field update techniques
Appreciation of Cryptographic algorithms and disciplines
Knowledge of SerDes technology
Hardware interfacing and electronics knowledge
Network programming experience
Experience:
Experience working in a team
Experience in embedded C/C++
Experience coding a low-level microprocessor or microcontroller
Experience optimizing low level code to meet real-time performance targets
Experience programming in interpreted object-oriented high-level languages (e.g. Python)
Experience working and programming on multiple platforms (e.g. Unix, Linux, Window and OSX)
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!
https://www.kandou.ai/
Skills Required
- Strong experience designing, coding, and debugging real-time applications in embedded C and/or C++
- Experience using or implementing real-time schedulers or RTOS
- Knowledge of 32-bit processor architecture
- Experience interfacing with hardware and peripherals, including SPI, I2C/SMBus, and JTAG
- Application-level and hardware-level debugging experience
- Knowledge of software validation and verification techniques
- Ability to develop across Linux and Windows platforms
- Experience with modern software workflows, including CI, GitLab, Makefile, and CMake
- Independent, self-starting approach to driving firmware development
- Teamwork experience
- Experience coding embedded C/C++
- Experience programming low-level microprocessors or microcontrollers
- Experience optimizing low-level code for real-time performance targets
- Experience programming in interpreted object-oriented languages such as Python
- Experience programming across multiple platforms, including Unix, Linux, Windows, and macOS
- Experience with Python or Lua development
- Experience interfacing with flash memory and implementing in-field updates
- Knowledge of cryptographic algorithms and practices
- Knowledge of SerDes technology
- Hardware interfacing and electronics knowledge
- Network programming experience
What We Do
Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.
