Software Engineer - 2 openings

Posted 2 Days Ago
2 Locations
Hybrid
Entry level
Artificial Intelligence • Hardware • Semiconductor
The Role
Develop software for Kandou’s chiplet-based AI memory fabric and high-speed interconnect technology. Responsibilities require C++ and Python programming, efficient algorithms and data structures, cross-platform development, embedded and low-level programming, GUI toolkit knowledge, version control, documentation, software verification, and regression testing. The role is based in Hyderabad or Bangalore and may involve occasional travel.
Summary Generated by Built In

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

We are actively seeking Software Engineers either based in Hyderabad OR Bangalore.

Experience:

  • Working in a team.

  • Be quick to pick up and learn new things.

  • Have experience of object-oriented computer languages and coding in C++ and Python.

  • Have knowledge of efficient algorithms and data structures.

  • Have experience working with Unix and Windows operating systems.

  • Understand software version control (e.g. git, mercurial, perforce).

  • Have experience with coding styles and documentation.

  • Have knowledge of software verification and regression techniques.

  • Be able available for occasional travel (pandemics permitting).

Knowledge of:

  • High speed serial communication (SERDES).

  • Low speed serial communication (SPI, I2C).

  • Graphical user interface design and GUI toolkits (GTK, QT)

  • Programming on multiple platforms (Unix/Linux/Windows/MacOS).

  • Low level programming (assembly language for micro-processors/ controllers).

  • Embedded programming.

Education:

The candidate should have at least a Bachelors’ degree in Computer Science (or equivalent).

Knowledge, experience or formal training in electronics is an advantage.

If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!

https://www.kandou.ai/

Skills Required

  • Bachelor’s degree in Computer Science or equivalent
  • Experience working in a team
  • Ability to quickly learn new concepts and technologies
  • Experience with object-oriented programming languages, including C++ and Python
  • Knowledge of efficient algorithms and data structures
  • Experience with Unix and Windows operating systems
  • Understanding of software version control systems such as Git, Mercurial, or Perforce
  • Experience with coding standards and technical documentation
  • Knowledge of software verification and regression testing techniques
  • Knowledge of high-speed serial communication, including SERDES
  • Knowledge of low-speed serial communication, including SPI and I2C
  • Knowledge of GUI design and toolkits such as GTK or Qt
  • Experience programming across Unix, Linux, Windows, and macOS platforms
  • Knowledge of low-level programming and assembly language for microprocessors or controllers
  • Knowledge of embedded programming
  • Electronics knowledge, experience, or formal training
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The Company
222 Employees

What We Do

Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.

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