At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
We are actively seeking a Software Architect either based in Hyderabad OR Bangalore.
Responsibilities:
Architect CMIS 5.x stack (DataPath State Machine, VDM, I2C/MCTP, FW-SW interface)
Lead host interop tests for hyperscalers (Meta, AWS, etc.), build test matrix and regression suite
Develop manufacturing test orchestration (ATE integration, yield analytics, on-chip stimulus)
Build telemetry pipeline from FW to host/cloud (formats, compression, SDK APIs)
Own customer SDK and tools (C/Python, CLI, log analysis), release management
Ensure standards compliance (CMIS 5.x, OSFP MSA, SFF-8024, OIF)
Travel: Up to 25% (customer engagement, manufacturing, standards)
Skills:
Good knowledge of C/C++, Python, systems language (Go/Rust); CI/CD, conformance tests
Good knowledge of I2C/MCTP, SFF-8024, vendor extensions
Good understanding of standards implementation (OIF, SFF, IEEE mgmt-plane)
Good knowledge of architecture documentation (SHALL/MUST, REQ traceability)
Self-motivated, with strong sense of ownership and responsibility
Good communication and reporting skills
Experience:
Principal / Senior Staff (8-10 years post-degree)
8-10 years high-speed interconnect software (module SW, management, test, SDK)
CMIS 4.x/5.x implementation and OSFP MSA experience
Hyperscaler interop with NIC/switch ASICs (Nvidia, Broadcom)
Test software architecture with ATE/yields
Manufacturing and field support experience
Education:
BS in Electrical Engineering, Computer Engineering, or Computer Science (MS preferred)
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!
https://www.kandou.ai/
Skills Required
- 8-10 years of high-speed interconnect software experience, including module software, management, testing, or SDK development
- Experience implementing CMIS 4.x or 5.x
- OSFP MSA experience
- Experience with hyperscaler interoperability involving NICs and switch ASICs, including Nvidia or Broadcom
- Experience architecting test software involving ATE and yield analytics
- Manufacturing and field support experience
- Strong knowledge of C or C++, Python, and a systems language such as Go or Rust
- Experience with CI/CD and conformance testing
- Knowledge of I2C, MCTP, SFF-8024, and vendor extensions
- Understanding of OIF, SFF, and IEEE management-plane standards implementation
- Knowledge of architecture documentation using SHALL/MUST requirements and traceability
- Bachelor's degree in Electrical Engineering, Computer Engineering, or Computer Science
- Master's degree in a relevant field
What We Do
Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.
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