SoC Physical Design Verification Engineer

Posted 12 Hours Ago
Be an Early Applicant
3 Locations
In-Office
100K-500K Annually
Expert/Leader
Hardware • Manufacturing
The Role
Drives full-chip physical verification signoff and tapeout closure for advanced-node SoCs. Responsibilities include debugging DRC, LVS, ERC, PERC, antenna, and DFM issues; optimizing verification flows with Python and Tcl; collaborating with RTL, physical design, CAD, packaging, and foundry teams; and supporting padring, bump/RDL, ESD, IR drop, and electromigration analysis. The role also includes mentoring and developing scalable physical verification methodologies.
Summary Generated by Built In

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Tenstorrent is seeking a SoC Physical Design Verification Engineer to drive full-chip signoff and ensure manufacturable, high-quality silicon across advanced technology nodes. You’ll lead physical verification closure (DRC, LVS, ERC, etc.), debug issues using standard industry PV tools, and collaborate across RTL, PD, CAD, and packaging teams to achieve successful tapeouts. If you thrive in a fast-paced environment and enjoy solving complex challenges in cutting-edge silicon, we’d love to hear from you.

This role is hybrid, based out of Santa Clara, CA; Austin, TX; or Fort Collins, CO.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.


Who You Are

  • A seasoned engineer with a strong background in CPU/IP/SoC physical verification and tapeout closure.
  • A hands-on problem solver who excels at debugging and driving signoff through complex verification flows.
  • A collaborative team player who works effectively across RTL, PD, CAD, and foundry interfaces.
  • A mentor and technical leader passionate about building efficient, manufacturable silicon.

What We Need

  • BS or MS in Engineering (Electrical, Electronics, or related field).
  • 7–14 years of hands-on experience in CPU/IP/SoC physical verification.
  • Strong command of industry-standard tools and flows (Calibre, ICV, Pegasus, FC, Innovus, etc.).
  • Proven expertise in DRC, LVS, ERC, PERC, Antenna, and DFM verification.
  • Solid understanding of advanced node challenges (7nm, 5nm, 3nm) and FinFET design considerations.
  • Scripting proficiency (Python, TCL) for automation and flow optimization.
  • Familiarity with ESD planning, padring integration, bump/RDL strategies, and reliability analysis (IR drop, EM).

What You Will Learn

  • Advanced physical verification methodologies and flow optimization for next-generation SoCs.
  • Integration and verification strategies for full-chip signoff across advanced process technologies.
  • Cross-functional collaboration across design, CAD, and foundry teams to ensure flawless tapeouts.
  • Leadership and mentoring opportunities in building scalable PV methodologies and automation.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology.  Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2).   These requirements apply to persons located in the U.S. and all countries outside the U.S.  As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.  If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.

Skills Required

  • BS or MS degree in Engineering, Electrical Engineering, Electronics Engineering, or a related field
  • 7-14 years of hands-on experience in CPU, IP, or SoC physical verification
  • Strong command of industry-standard physical verification tools and flows, including Calibre, ICV, Pegasus, Fusion Compiler, and Innovus
  • Expertise in DRC, LVS, ERC, PERC, antenna, and DFM verification
  • Understanding of advanced-node challenges at 7nm, 5nm, and 3nm
  • Knowledge of FinFET design considerations
  • Python and Tcl scripting proficiency for automation and flow optimization
  • Familiarity with ESD planning, padring integration, bump/RDL strategies, and reliability analysis including IR drop and electromigration
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The Company
HQ: Toronto, ON
389 Employees
Year Founded: 2016

What We Do

Tenstorrent is a next-generation computing company that builds computers for AI. Headquartered in Toronto, Canada, with U.S. offices in Austin, Texas, and Silicon Valley, and global offices in Belgrade and Bangalore, Tenstorrent brings together experts in the field of computer architecture, ASIC design, advanced systems, and neural network compilers. Join us: www.tenstorrent.com/careers

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