SOC Lead

Location:   This position is located in Austin, TX. It is a hybrid role with 3 days in office and 2 days work from home each week. It is NOT open to 100% remote.

Business Line Description:
•MPU Engineering team defines and develops System on Chip, ASIC’s, Digital and Analog IP’s for a wide range of products, including automotive microprocessors, application processors, microcontrollers, and network processors.

Responsibilities: 
• Lead product execution for Automotive/Consumer/Industrial ASIL-B/D SoC’s
• Work with architects and systems engineering to define the part. Generate and analyze data to take right and cost-effective architecture decision.
• Work with IP, Technology, packaging partners to assess the right IP/packages and technology options for the part.
• Work with IP and SoC functions (front end, verification, AMS, DFT, Physical implementation) to understand and resolve inter/intra functional handoff and challenges.
• Oversee definition management and make sure the implementation complies with the requirements
• Work closely with downstream team's dependent on SOC, who are working on post-silicon activities, to make sure their needs are addressed

·        Work closely with Test and Product engineering teams to enable productization.

·        Work closely with post silicon evaluation teams (functional and analog Validation, Characterization, Application and Software teams) and address design issues.

• Work with Program management office for management attention and clearly articulate dependencies and help needed for timely execution of projects.
• Assess workload and resource demands based on complexity and create predictable project plans meeting customer requirements
• Mentor engineers across various functions
Cross functional aspects:
• This role is primarily about leading cross functional teams
• During part definition is includes a close interaction with Business, Systems, Architects, third party IP vendors
• During execution a close interaction and decision making is required between Technology, packaging, IP, Architecture, Various implementation functions, Test and Product Engineering.
• Post silicon, close collaboration is needed with Software, Test and production engineering, Application and Field teams.
• Overall, Chip lead is central design point of contact for all cross functional teams associated with the part.

Job Qualifications:
•    Bachelor‘s in engineering with 15 years of design development experience, with at least 5 years of leading complete design and/or design functions. 
•    MS in Electrical Engineering preferred (higher level education may substitute for some experience).
•    Experience in leading Global cross functional teams
•    Experience in leading designs in smaller geometries desired

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.