As a Silicon Photonics (SiP) Process or Product Integration Engineer, you will be part of Intel's SiP Process Development and Manufacturing (SPDM) team that is leading Intel's market transition and driving innovation for the next generation of optical interconnect products. You will play a critical role in the next generation of silicon photonics product roadmaps, fabrication process development, yield improvement roadmaps, and reliability qualifications.
Primary Responsibilities:
A Process Integrator collaborates with Yield Analysis, Device and Defect Engineers, IPS (SiP Product Division) designers, and Process Engineers to ensure new processes and products are capable of meeting yield and reliability requirements at the time of PRQ.
Defines and establishes process flow, procedures, and required equipment to develop new devices or products. Plans and conducts experiments to fully characterize the process throughout the development cycle.
Trains production/receiving engineers for transfer to high volume manufacturing.
A Product Integration Engineer (PIE) will act as a key technical leader and the primary fab contact for integrating one or more products from customer roadmaps into F11x's fabrication process.
You will be responsible for driving and managing yield optimization efforts, New Product Introduction (NPI) roadmaps, process development, and Test/SORT/Burn-in capacity/capability to deliver product qualification milestones throughout all phases of the product life cycle (PLC).
You will be highly engaged in cross-functional teams to solve technical problems and deliver product milestones; interfacing between IPS, F11x process engineering, finance, planning, wafer-level test, quality and reliability (QnR), and OSAT teams.
You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and/or schoolwork/classes/research.
Minimum Qualifications
Bachelors in Engineering (Chemical, Electrical, Materials, etc.) and/or Science discipline such as Materials Science, Physics, Optics/Photonics.
2+ years of experience in semiconductor and/or silicon photonics process technology.
2+ years of experience in advanced data analysis (using JMP, GAJT and/or SQL), statistical process control (SPC), and design of experiment (DOE) principles.
Preferred Requirements:
Masters or Ph.D. in Engineering (Chemical, Electrical, Materials, etc.) and/or Science discipline such as Materials Science, Physics, Optics/Photonics.
1+ years of experience in any of the following: Optics, Photonics, SiP, Lasers, or III/V compound.
1+ years of experience with process integration roles in silicon photonics or other semiconductor technologies.
Good time management skills, self-motivated, and have strong desire to succeed in a fast-paced and challenging environment. Ability to learn quickly, be resourceful and have strong problem solving skills.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, New Mexico, AlbuquerqueAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in engineering or a science discipline such as materials science, physics, or optics/photonics
- 2+ years of experience in semiconductor and/or silicon photonics process technology
- 2+ years of experience with advanced data analysis using JMP, GAJT, and/or SQL
- Experience with statistical process control and design of experiment principles
- Master's or Ph.D. in engineering or a relevant science discipline
- 1+ years of experience with optics, photonics, silicon photonics, lasers, or III/V compounds
- 1+ years of process integration experience in silicon photonics or other semiconductor technologies
- Strong time management, self-motivation, problem-solving, adaptability, and ability to work in a fast-paced environment
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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