At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
Senior SI/PI Engineer either based in Hyderabad, Bangalore or Taiwan.
We are looking for a Senior SI/PI Engineer with strong hands-on experience in signal integrity and power integrity for semiconductor, package, PCB, and high-speed interconnect applications. The ideal candidate will have deep expertise in electromagnetics, system-level design, material interactions across package, PCB, connector, and cable domains, and the ability to solve complex high-speed design challenges in real-world systems.
Key Responsibilities
- Perform and lead theoretical and simulation-based SI analysis of PCB products, channels, test structures, and system implementations.
- Drive Signal and power delivery solutions for PCB and Package and evaluation platforms in collaboration with design teams.
- Work closely with circuit designers to ensure robust SI/PI implementation in silicon.
- Partner with technology and product teams to guide SI/PI architecture and resolve system-level challenges.
- Engage with customers and suppliers to define and validate hardware solutions including packages, PCB/backplane layouts, materials, interposers, and connectors.
- Prepare and communicate technical analyses and recommendations to internal teams and external stakeholders.
- Evaluate and benchmark signaling schemes such as Chord signaling and PAM in terms of SI/PI performance, power, and implementation trade-offs.
Required Experience
- 12+ years of experience in the semiconductor industry, with a focus on signal and power integrity.
- Strong foundation in electromagnetics and system-level design, including material behavior across package, PCB, board, connector, and cable, as well as analog, power, and digital electronics.
- Proven experience solving significant SI problems through innovative connector, package, or cable design.
- Hands-on problem-solving ability with the capability to quickly grasp new concepts and translate them into practical solutions.
- Strong cross-functional communication skills and a collaborative working style.
- Experience with high-speed interfaces including DDR5 and PCIe.
- Experience with Cadence board layout environments and SI/PI tools.
Technical Skills
- Deep understanding of SI/PI design and simulation across abstraction levels, from EM modeling to system-level link behavior.
- Expertise with EM/SI/PI tools and modeling flows, including calibration, correlation, and validation.
- Familiarity with lab measurements using VNA, spectrum analyzers, and high-speed oscilloscopes.
- Strong intuition for EM simulation trade-offs, including accuracy, runtime, model complexity, and design impact.
- Experience with channel modeling and extraction for multi-Gbps systems, including end-to-end link considerations.
- Proficiency in Linux-based design environments and scripting for modeling and automation.
- Solid understanding of signaling schemes and link architectures, including performance, complexity, and power trade-offs.
Preferred Qualifications
- Experience with DDR5 interface analysis, routing considerations, and channel optimization.
- Experience with PCIe channel design, equalization, and validation.
- Hands-on experience with Cadence Allegro, Sigrity, Clarity 3D, and related toolset.
- Exposure to advanced PCB Layout techniques for large server-based systems
- Strong documentation and presentation skills for technical reviews and customer communication.
Education
- Required: Master’s degree in Physics, Electronics, Electrical Engineering, or equivalent.
- Desired: PhD in electromagnetics-related areas such as Physics, Electrical Engineering, or Electronics Engineering.
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!
www.kandou.ai
Skills Required
- 15+ years of experience in the semiconductor industry
- Strong foundation in electromagnetics and system-level design
- Proven leadership of SI/PI, package, and PCB teams
- Hands-on problem solver of SI issues
- Collaborative team player with strong communication skills
- Masters of Engineering in Physics Electronics or Electrical Engineering
- PhD in electromagnetics related areas (preferred)
What We Do
Founded in 2011, Kandou is the innovative leader in high-speed, energy efficient, chip-to-chip link solutions critical to the evolution of the electronics industry. Kandou enables a better-connected world by offering disruptive technology through licensing and standard products that empower the devices we use every day to become smaller, more energy efficient and more cost effective. Kandou has a strong IP portfolio that includes Chord™ signaling, which has been adopted into industry specifications by JEDEC and the OIF. These innovations and implementations deliver a fundamental advance in interconnect technology that lowers the power consumed and improves the performance of chip links, unlocking new capabilities for customer devices and systems. Kandou is a fabless semiconductor company headquartered in Lausanne, Switzerland with offices in Europe, North America and Asia.
