Senior/ Staff Signal and Power Integrity Engineer

Posted 13 Days Ago
Be an Early Applicant
Bengaluru, Bengaluru Urban, Karnataka, IND
Hybrid
Senior level
3D Printing
The Role
Perform SI/PI analysis and 2D/3D EM simulations for high-speed package, PCB and system designs; optimize PDNs, run frequency/time-domain and channel simulations, support layout reviews, correlate simulations with lab measurements, and document recommendations.
Summary Generated by Built In
Company Description

Renesas is a global semiconductor company providing hardware and software solutions for a range of cutting-edge technologies including self-driving cars, robots, automated factory equipment, and smart home applications. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you.

Renesas is a global, multi-billion dollar, publicly traded company headquartered in Japan, and has subsidiaries in 20 countries worldwide. Renesas is a dynamic, multi-cultural technology company where employees learn, mentor, innovate and thrive. Renesas is extending our share in fast-growing data economy-related markets such as infrastructure and data center and strengthening our presence in the industrial/IOT and automotive segments. Our solutions drive products developed by major innovators around the world. Join us and build your future by being part of what’s next in electronics.

Job Description

Role Overview

We are seeking a highly skilled Signal and Power Integrity Engineer to support the design, analysis, and validation of high‑speed package and board designs. The ideal candidate will have strong fundamentals in electromagnetics and high‑speed signalling, hands‑on experience with industry‑standard simulation tools, and an ability to collaborate across silicon and systems teams to deliver robust, manufacturable products.

Key Responsibilities

  • Perform signal integrity (SI) and power integrity (PI) analysis for high‑speed package, PCB and system level designs.
  • Conduct 2D and 3D EM simulations to evaluate interconnect performance to mitigate crosstalk, impedance, and loss.
  • Analyse and optimize power distribution networks (PDN) including power plane design, decoupling strategies, and IR drop analysis.
  • Execute frequency‑domain and time‑domain simulations for high‑speed interfaces.
  • Perform channel simulations and system‑level analysis using tools such as ADS and HSpice.
  • Support design reviews, layout guidance, and ECO cycles with SI/PI recommendations.
  • Work with validation teams to correlate simulation results with lab measurements and debug signal and power integrity issues.
  • Develop and maintain technical documentation, reports, and presentations.
  • Collaborate closely with PCB layout, hardware, packaging, and validation teams.

Required Qualifications

  • Strong fundamentals in electromagnetics, transmission lines, and microwave theory.
  • Hands‑on experience with EM simulation tools such as: ANSYS HFSS, SI-Wave, Cadence Power-SI.
  • Experience with circuit analysis and simulation tools: ADS, HSpice. Proficiency in handling and analysing IBIS/Spice models.
  • Experience in power plane modelling and analysis using tools such as Power-SI, Power DC or SI-wave.
  • Working knowledge of package and PCB technologies including stack‑up analysis, DFM, material behaviour etc.
  • Solid understanding of high‑speed signalling in both time and frequency domains.
  • Nice to have: hands‑on experience with lab measurement equipment including VNA, oscilloscopes, TDR and spectrum analysers.
  • Experience in test case development and automation using scripting languages (Python, MATLAB, or similar).
  • Strong communication, presentation, and documentation skills with the ability to work effectively in a team environment.

Qualifications

Experience Level

  • Bachelor’s degree in electrical / Electronic Engineering with 5+ years of relevant industry experience
    or
  • Master’s degree in electrical engineering with 3+ years of relevant experience.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Skills Required

  • Strong fundamentals in electromagnetics, transmission lines, and microwave theory
  • Hands-on experience with EM simulation tools such as ANSYS HFSS, SI-Wave, Cadence Power-SI
  • Experience with circuit analysis and simulation tools: ADS, HSpice; proficiency handling IBIS/Spice models
  • Experience in power plane modelling and analysis using Power-SI, Power DC or SI-Wave
  • Working knowledge of package and PCB technologies including stack-up analysis, DFM, material behavior
  • Solid understanding of high-speed signalling in time and frequency domains
  • Experience in test case development and automation using scripting languages (Python, MATLAB, or similar)
  • Strong communication, presentation, and documentation skills; ability to work effectively in a team
  • Hands-on lab measurement experience (VNA, oscilloscopes, TDR, spectrum analyzers)
  • Bachelor's in Electrical/Electronic Engineering with 5+ years OR Master's in Electrical Engineering with 3+ years

Renesas Electronics Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.

  • Fair & Transparent Compensation Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
  • Healthcare Strength Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
  • Leave & Time Off Breadth Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.

Renesas Electronics Insights

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The Company
HQ: Tokyo
10,040 Employees

What We Do

We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.

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